Semiconductor Laser Submount Layout for Consistent Emission Position
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Solution Overview
Problem
Existing light-emitting devices face challenges in efficiently using submounts with the same design for semiconductor laser elements of different lengths, leading to issues with light emission position deviation and optical design complexity.
Innovation Solution
The use of submounts with identical designs for semiconductor laser elements of varying lengths, where protective elements are positioned to avoid overlap with specific virtual straight lines parallel to the laser elements' surfaces, ensuring stable mounting and reduced deviation in light emission positions, facilitating common use across different resonator lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If submounts with different designs are used for semiconductor laser elements of different lengths, then the mounting can be optimized for each element, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The submount is designed with a universal structure that can accommodate semiconductor laser elements of different lengths. The wiring layer pattern is configured to support both first and second semiconductor laser elements with different resonator lengths using the same submount design, eliminating the need for multiple specialized submount designs while maintaining mounting precision.
Solution Approach 2:
The wiring layer is divided into multiple regions (first wiring region, second wiring region, third wiring region) that can be selectively connected to different terminal electrodes. This segmentation allows the same submount structure to be flexibly configured for different laser element lengths by activating only the necessary wiring regions, reducing overall device complexity.
2Productivity
If semiconductor laser elements of different lengths are mounted on the same submount, then productivity improves, but light emission position deviation increases
Solution Approach 1:
Different wiring regions are designed with specific local characteristics to compensate for the different lengths of semiconductor laser elements. The first wiring region connects to terminal electrodes positioned to accommodate shorter elements, while the third wiring region connects to terminal electrodes positioned for longer elements, ensuring that light emission positions remain accurate despite using the same submount for both.
3Volume of moving object
If protective elements are positioned closer to semiconductor laser elements, then the device size is reduced, but the reliability of the protective elements decreases
Solution Approach 1:
Protective elements are positioned in the lateral direction relative to the semiconductor laser elements rather than only in the longitudinal direction. This spatial arrangement allows the protective elements to be closely positioned to the laser elements, reducing overall device size, while still maintaining sufficient protective function through their strategic lateral placement near terminal electrodes.
Data Source
AI summary
A light-emitting device includes first and second semiconductor laser elements, first and second protective elements, and first and second submounts. The second semiconductor laser element has a length greater than the first semiconductor laser element. In a top view, the first protective element is not placed between first and second virtual straight lines respectively passing through and parallel to the light-emitting surface and the first lateral surface of the first semiconductor laser element, and a part or all of the second protective element is placed between third and fourth virtual straight lines respectively passing through and parallel to the light-emitting surface and the first lateral surface of the second semiconductor laser element. In the top view, a midpoint of the light-emitting surface of each of the first and second semiconductor laser elements does not coincide with a midpoint of the first and second submounts, respectively.