Laser Submount Etching for HAMR Alignment Precision
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Solution Overview
Problem
Current methods for submount dicing in HAMR devices do not produce smooth, well-aligned edges, requiring active adjustment and resulting in slow or costly laser-to-submount assembly with low yields due to imprecise alignment between the laser and submount.
Innovation Solution
An anisotropic etching process, such as reactive ion etching (RIE), is used to precisely create bonding surfaces on laser-on-slider submounts, enabling precise alignment and potentially allowing for mass production with passive self-alignment during solder reflow and mechanical stops.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If current submount dicing methods are used, then production cost and time are reduced, but alignment precision between laser and submount deteriorates
Solution Approach 1:
The patent applies preliminary action by pre-forming precise alignment features (scribe lines, notches, or tabs) on the submount during the dicing process before laser assembly. This pre-positioning of alignment references eliminates the need for post-assembly adjustment, enabling both high precision and automated fast assembly.
Solution Approach 2:
The patent replaces manual active adjustment mechanisms with passive mechanical alignment features integrated into the submount structure. The scribe lines and notches provide self-aligning geometric references that guide laser placement without requiring operator intervention or complex adjustment equipment.
2Ease of manufacture
If current submount dicing methods are used, then production cost is reduced, but assembly complexity increases due to active adjustment requirements
Solution Approach 1:
The patent implements self-service by designing submounts with self-aligning features that automatically guide laser placement. The scribe lines and geometric notches on the submount serve as self-contained alignment references, eliminating the need for external alignment tools or operator skills, thereby simplifying the assembly process.
3Productivity
If current submount dicing methods are used, then production speed is maintained, but yield decreases due to imprecise alignment
Solution Approach 1:
By pre-forming precise alignment features during dicing, the patent ensures that every submount has built-in alignment references before assembly. This preliminary precision work prevents misalignment failures during assembly, thereby improving yield without sacrificing production speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach facilitates cost-effective manufacturing by ensuring precise alignment between the laser and submount, enabling efficient assembly with improved yields and reduced production costs.
Implementation Method 1
An etching process is used to form scribe lines at a first surface of the wafer. The scribe lines define submount edges and provide control of an alignment dimension between the submount edges and the laser-to-slider submount features.
Implementation Method 2
Material is removed from a second surface of the wafer that is opposed to the first surface. The removing of the material from the second surface separates submounts at the scribe lines and defines a thickness of the submounts.
Implementation Method 3
The wafer is separated from the temporary layer to form submounts. The separating of the wafer from the temporary layer separates submounts at the scribe lines.
Data Source
AI summary
A wafer is formed having a plurality of laser-to-slider submount features on a first surface. An etching process is used to form scribe lines between the submounts on the first surface of the wafer. The wafer is separated at the scribe lines to form the submounts.