Semiconductor Laser Submount Layout for Thermal Expansion Relief
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Solution Overview
Problem
Light-emitting devices with semiconductor laser elements face challenges due to thermal expansion, leading to increased load between components, which can result in disconnection and damage.
Innovation Solution
A light-emitting device design featuring a heat dissipation member with a mounting surface, a frame body, and a submount with a bonded and non-bonded region, allowing for reduced load between components during thermal expansion, utilizing a heat dissipation member with a second upper surface and a frame body with a second lower surface bonded to the heat dissipation member's second upper surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If components are fully bonded together to maintain structural integrity, then strength is improved, but thermal expansion causes increased load and potential disconnection
Solution Approach 1:
The lower surface of the submount is divided into two distinct regions: a first region that is bonded to the heat dissipation member and a second region that is not bonded and faces the frame body. This segmentation allows the bonded region to maintain structural strength while the non-bonded region accommodates thermal expansion, preventing excessive load and potential disconnection.
2Stability of the object's composition
If material selection focuses on matching thermal expansion coefficients, then thermal expansion compatibility is improved, but device complexity increases due to material constraints
Solution Approach 1:
Rather than requiring all components to have matched thermal expansion coefficients, the invention segments the submount's lower surface into bonded and non-bonded regions. This allows different materials with different thermal expansion properties to be used without compromising overall thermal stability, as the non-bonded region absorbs expansion differences.
Solution Approach 2:
The submount exhibits different bonding characteristics in different regions: the first region has strong bonding for structural integrity, while the second region has no bonding to accommodate thermal expansion. This local differentiation of bonding quality allows the device to handle thermal expansion without requiring uniform material properties throughout.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the load experienced between components during thermal expansion, preventing disconnection and damage, while maintaining efficient heat transfer and bonding strength.
Implementation Method 1
heat dissipation member having a mounting surface
Implementation Method 2
components in the light-emitting device expand due to heat generated from the semiconductor laser element during driving
Data Source
AI summary
A light-emitting device includes: a heat dissipation member having a mounting surface; a frame body fixed to the heat dissipation member and having an upper surface; a submount supported by the mounting surface and having an upper surface and a lower surface; and a semiconductor laser element supported by the upper surface of the submount. The lower surface of the submount includes a first region bonded to the mounting surface and a second region facing the upper surface of the frame body and not bonded to the upper surface of the frame body.