Laser Diode Submount and Lens Support Alignment Structure
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Solution Overview
Problem
Misalignment between a laser diode chip and a lens in a laser light source can cause significant deviation in the orientation of emitted laser light, leading to inefficiencies and potential decreases in output power.
Innovation Solution
A laser light source design featuring a semiconductor multilayer structure with a submount and lens supports that fix the laser diode chip in a face-down position, with the emission layer closer to the submount, and a collimating lens bonded to the lens supports, ensuring precise alignment and reducing misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a laser diode chip and a lens are housed in a semiconductor laser package with a submount, then the laser light can be collimated effectively, but even a slight misalignment between the laser diode chip and the lens may cause a great deviation in orientation of the optical axis
Solution Approach 1:
The patent introduces lens supports as intermediary components that are integrally formed with the submount. These lens supports serve as precise positioning intermediaries between the submount and the lens, ensuring accurate alignment. The lens supports include positioning protrusions that fit into corresponding recesses on the lens, creating a reliable mechanical interface that prevents misalignment while maintaining manufacturing feasibility.
2Temperature
If the laser diode chip is fixed face-down on the submount, then heat dissipation is improved, but the positioning accuracy relative to the lens may be compromised
Solution Approach 1:
The patent segments the submount structure into distinct functional zones: a mounting surface for the laser diode chip and separate lens supports for lens positioning. This segmentation allows the chip mounting area to be optimized for thermal management while the lens supports provide independent, precise positioning features. The lens supports are integrally formed with the submount but function as separate positioning elements, enabling both heat dissipation and alignment precision to be optimized independently.
Data Source
AI summary
A laser light source includes: a laser diode chip including an emission layer, a substrate supporting the emission layer, and an emission end surface; a submount that includes a principal surface on which the laser diode chip is fixed and a pair of lens supports located at opposite sides with respect to the emission end surface of the laser diode chip; a lens bonded to the end surfaces of the pair of lens supports; and a semiconductor laser package housing the aforementioned elements. The laser diode chip is fixed to the submount with the emission layer being closer to the submount than is the substrate. The emission end surface of the laser diode chip is located outward with respect to an edge of the principal surface. The end surfaces of the pair of lens supports are located outward with respect to the first end surface of the laser diode chip.