Semiconductor Laser Submount Solder Layout to Prevent Tilting
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Solution Overview
Problem
The semiconductor laser device experiences tilting issues due to uneven solder protrusion during the joining process, which affects the optical precision and stability of the device.
Innovation Solution
A semiconductor laser device design featuring a submount with a solder layer that includes protruding portions at regular intervals on the pedestal, preventing tilting by ensuring even solder distribution and attachment, and a testing method to determine the tilt of the submount by measuring the state of these protruding portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a solder-provided submount is heated to melt the solder layer for joining, then the submount and pedestal are joined together, but the molten solder may protrude extremely lopsidedly causing the submount to tilt
Solution Approach 1:
The solder layer is segmented into multiple discrete solder portions arranged in a specific pattern rather than a continuous layer. This segmentation controls where solder protrusion occurs, preventing lopsided protrusion and submount tilting while maintaining joining strength.
Solution Approach 2:
The solder layer is prepared in advance with a specific pattern of solder portions before the joining process. This preliminary configuration ensures that when the solder melts, the protrusion occurs in a controlled manner that prevents tilting, rather than allowing random protrusion patterns.
2Reliability
If the solder layer is melted to join the submount to the pedestal, then the components are joined, but the optical precision deteriorates due to submount tilting
Solution Approach 1:
By segmenting the solder layer into controlled portions, the invention prevents uncontrolled protrusion that would cause tilting. This maintains the submount's alignment precision and optical performance while ensuring reliable joining through the distributed solder portions.
Solution Approach 2:
The solder layer has different properties in different locations - solder portions are present in some areas and absent in others. This local variation controls the protrusion behavior during melting, preventing tilting in critical areas while maintaining joining reliability in other areas.
3Area of stationary object
If a continuous solder layer is used for joining, then complete coverage is achieved, but uneven protrusion occurs causing tilting
Solution Approach 1:
The continuous solder layer is replaced with segmented solder portions that provide sufficient coverage for joining while controlling protrusion behavior. The segmented structure prevents the uneven stress distribution that causes tilting in continuous layers.
Solution Approach 2:
The solder distribution varies locally across the submount surface, with solder portions strategically positioned to provide adequate coverage for joining while preventing protrusion in areas that would cause tilting. This local quality control achieves both coverage and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents submount tilting relative to the pedestal, enhancing the optical precision and stability of the semiconductor laser device, and allows for accurate determination of tilt during the manufacturing process.
Implementation Method 1
by heating the solder-provided submount to melt the solder layer, the submount and the pedestal are joined with solder
Data Source
AI summary
A semiconductor laser device includes: a pedestal; a submount that is joined to the pedestal via solder; and a semiconductor laser that is mounted on the submount. When a view of the submount from a side on which the semiconductor laser is mounted is defined as a top view, in the top view: the solder includes a plurality of protruding portions; and the plurality of protruding portions are provided on the pedestal outside the submount, protrude in directions away from an inside of the submount, and are located at regular intervals on at least a portion of a periphery of the submount.