Semiconductor Laser Submount Step Structure for Heat Dissipation
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Solution Overview
Problem
High power semiconductor laser light emitting devices face challenges in efficiently conducting heat generated by increased current or multiple lasers, leading to reduced laser light output and reliability due to temperature increases, and require accurate mounting on a mounting base.
Innovation Solution
A semiconductor laser light emitting device design featuring a mounting base with a step and a submount where the first lateral face of the step and the front face of the submount are in thermal contact, allowing efficient heat dissipation and precise alignment for accurate mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the current flowing through the semiconductor laser is increased or a plurality of semiconductor lasers are used, then the power output is improved, but the temperature of the semiconductor laser increases leading to reduced reliability and output
Solution Approach 1:
The patent introduces a step structure on the mounting base that extends in the lateral direction, creating an additional thermal conduction path from the lateral face of the step to the mounting base. This dimensional expansion of the heat dissipation pathway allows heat to be conducted away more effectively, preventing temperature-induced reliability degradation while maintaining high power output.
Solution Approach 2:
The step structure acts as an intermediary thermal conduction element between the semiconductor laser and the mounting base. By positioning the step laterally adjacent to the semiconductor laser, it serves as a mediator that captures and conducts heat away from the laser, reducing the thermal load on the laser itself and thereby maintaining reliability at high power levels.
2Power
If the current flowing through the semiconductor laser is increased or a plurality of semiconductor lasers are used, then the power output is improved, but the temperature of the semiconductor laser increases leading to reduced output
Solution Approach 1:
The step structure extends in the lateral direction and provides an additional thermal conduction pathway from the lateral face to the mounting base. This lateral dimension expansion creates more surface area for heat dissipation, enabling effective temperature control even when high current or multiple lasers generate substantial heat.
Solution Approach 2:
The heat dissipation function is segmented into multiple independent pathways: one through the bottom face of the step and another through the lateral face of the step. This segmentation of the thermal conduction route allows heat to be distributed and conducted away through multiple channels, preventing localized overheating and maintaining lower operating temperatures.
3Loss of energy
If a higher power semiconductor laser light emitting device is achieved, then efficient heat conduction to the mounting base is required, but accurate mounting of the semiconductor laser on the mounting base becomes difficult
Solution Approach 1:
The step structure is positioned asymmetrically in the lateral direction relative to the semiconductor laser, with the step's lateral face specifically oriented to maximize thermal contact area. This asymmetric configuration optimizes heat conduction efficiency while the step's geometric features provide natural alignment references that facilitate accurate mounting during assembly.
Solution Approach 2:
The step structure serves multiple functions simultaneously: it provides thermal conduction through both its bottom and lateral faces, and it acts as an alignment reference feature for accurate mounting. This multi-functionality resolves the contradiction by integrating heat dissipation and positioning functions into a single structural element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat conduction from the semiconductor laser to the mounting base, maintaining output and reliability, while ensuring accurate mounting and alignment, thereby improving both heat dissipation performance and mounting accuracy.
Implementation Method 1
A first lateral face of the step and a front face of the submount are in thermal contact with each other
Data Source
AI summary
A semiconductor laser light emitting device includes: a mounting substrate that is an example of a mounting base including a step; a submount disposed above a bottom face of the step; and a semiconductor laser disposed on the submount. A first lateral face of the step and a front face of the submount are in thermal contact with each other, the front face of the submount being a face of the submount on a light-emission direction side of the semiconductor laser.