Semiconductor Laser Submount Layout for Waveguide Alignment

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Solution Overview

Problem

The existing semiconductor laser devices require multiple types of submounts to accommodate semiconductor laser elements with varying optical waveguide region positions, leading to cumbersome inventory control and increased complexity.

Innovation Solution

A semiconductor laser device design that uses a single type of submount with uniquely positioned fixing parts, allowing for the alignment of semiconductor laser elements with different optical waveguide region positions by rotating the submount, thereby eliminating the need for multiple submount types.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If multiple types of submounts are used to accommodate semiconductor laser elements with different optical waveguide region positions, then the alignment precision is improved, but the device complexity and inventory control difficulty increase

Engineering Contradiction:
Improvealignment precisionVSAvoidsubmount type complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The submount is designed with a universal structure that can accommodate semiconductor laser elements with different optical waveguide region positions. By providing multiple fixing parts (first fixing part, second fixing part, third fixing part) at different positions on the submount, a single submount type can support multiple element types, eliminating the need for multiple submount variants while maintaining precise alignment capabilities

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The submount is segmented into multiple fixing parts positioned at different locations. Each fixing part can independently secure a semiconductor laser element with its optical waveguide region at the corresponding position, allowing the single submount to handle multiple element configurations through selective use of different fixing parts

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If multiple types of submounts are used to accommodate semiconductor laser elements with different optical waveguide region positions, then the adaptability is improved, but the inventory control becomes troublesome

Engineering Contradiction:
Improveadaptability to different element positionsVSAvoidinventory control ease
Core Design Contradiction:
Adaptability or versatilityVSEase of operation

Solution Approach 1:

The submount serves multiple functions by incorporating fixing parts at various positions, enabling a single universal submount design to accommodate different semiconductor laser element types. This universality simplifies inventory management as only one submount type needs to be stocked and managed, despite the ability to support multiple element configurations

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If the position of the optical waveguide region changes on the semiconductor laser element, then the element design flexibility is improved, but the submount fixing position must change requiring different submount types

Engineering Contradiction:
Improveelement design flexibilityVSAvoidsubmount type variety
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The submount is divided into multiple fixing parts positioned at different locations corresponding to different optical waveguide region positions. This segmentation allows the single submount to accommodate elements with varying waveguide positions by selecting the appropriate fixing part, thereby supporting design flexibility without increasing submount type variety

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS12142892B2Semiconductor laser device
Publication Date: 2024.11.12 NICHIA CORP
  • US12142892B2 patent drawing
  • US12142892B2 patent drawing
  • US12142892B2 patent drawing

AI summary

A semiconductor laser device includes: a housing including: a first upper upward-facing surface, a mounting surface below the first upper upward-facing surface, inner lateral surfaces including a first inner lateral surface and a second inner lateral surface facing the first inner lateral surface, wherein the first upper upward-facing surface and the mounting surface are formed inward of the inner lateral surfaces, and a first wiring part disposed on the first upper upward-facing surface; a semiconductor laser element including: a light output surface, a first lateral surface extending from the light output surface and facing the first inner lateral surface, and a second lateral surface extending from the light output surface and opposite to the first lateral surface; and a first wire connected to the first wiring part for electrical connection of the semiconductor laser element.