Laser Substrate Cleaning With Rotating Shields for Nano-Contaminants
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Solution Overview
Problem
Current semiconductor manufacturing techniques fail to effectively remove nano-contaminants and effluents from substrates, particularly during the cleaning process, leading to reduced yield and performance of semiconductor devices due to the presence of chemical contaminants and particles at sub-micron or nanometer levels.
Innovation Solution
A substrate cleaning method utilizing a laser-based system with rotating shields and a gas flow mechanism to simultaneously clean both faces and edges of substrates, employing excimer lasers and ultrapure nitrogen to break molecular bonds and evacuate contaminants, ensuring a clean substrate without the use of chemicals or liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cleaning methods are used, then the cleaning process is simple, but nano-contaminants and effluents cannot be effectively removed from substrates
Solution Approach 1:
The cleaning system is divided into multiple independent modules: laser sources for different wavelengths, rotating shields with specific geometries, and separate gas flow paths. Each module performs a specific function (e.g., UV laser for organic contaminant removal, visible laser for inorganic contaminant removal), allowing the system to achieve high cleaning precision while maintaining modularity and manageable complexity
Solution Approach 2:
Ultrapure nitrogen gas serves as an intermediary medium that carries away effluents and contaminants from the substrate surface during laser cleaning. The rotating shields act as intermediaries to distribute and direct the gas flow, enhancing contaminant removal efficiency without requiring direct contact between the laser and contaminants
2Manufacturing precision
If chemical cleaning methods are used, then contaminants can be removed, but chemical residues may remain on the substrate
Solution Approach 1:
The patent replaces chemical cleaning mechanisms with a physical laser-based cleaning system. Lasers deliver energy to break molecular bonds of contaminants, and mechanical gas flow removes the decomposed particles, eliminating the need for chemical cleaners and preventing chemical residue contamination
Solution Approach 2:
The system uses controlled laser parameters (wavelength, pulse duration, intensity) to selectively remove contaminants based on their molecular composition. By adjusting these parameters, the system can target specific contaminant types without affecting the substrate, achieving high precision cleaning without chemical residues
3Productivity
If both faces and edges of substrates are cleaned simultaneously, then cleaning efficiency is improved, but the system complexity increases
Solution Approach 1:
The patent introduces rotational motion as an additional dimension to the cleaning process. By rotating the substrate or cleaning heads, the system achieves three-dimensional coverage of all substrate surfaces (both faces and edges) simultaneously, transforming a potentially complex multi-position system into a simpler rotational mechanism
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid and efficient removal of nano-contaminants, achieving a clean substrate at the molecular level, thereby improving the yield and performance of semiconductor devices by ensuring all surfaces are cleaned simultaneously and effectively.
Implementation Method 1
employing excimer lasers and ultrapure nitrogen to break molecular bonds
Implementation Method 2
flowing an ultra-clean gas (e.g., nitrogen) to assist in evacuating effluents from nearby the substrate
Implementation Method 3
evacuating effluents from nearby the substrate and within the chamber
Data Source
AI summary
Various embodiments comprise apparatuses and related methods for cleaning a substrate. In one embodiment, an apparatus includes a substrate holder to hold and rotate the substrate at various speeds. An optional inner shield and an optional outer shield, when in a closed position, surround the substrate holder during operation of the apparatus. Each of the inner shield and the outer shield can operate independently in at least one of rotational speed and direction from the other shield. At least one of a front-side laser and a back-side laser are arranged to clean one or both sides of the substrate and edges of the substrate substantially concurrently or independently by impinging a light onto at least one surface of the substrate. A gas flow, combined with a high rotational-speed of the shields and substrate, assists in removing effluents from the substrate. Additional apparatuses and methods of forming the apparatuses are disclosed.