Laser Substrate Cutting for Display Devices Minimizing Carbonization

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Solution Overview

Problem

Existing display device manufacturing processes face challenges in minimizing carbonization and damage during the cutting of substrates, particularly when differentiating between pad and non-pad areas with varying thicknesses and surface roughness.

Innovation Solution

A method involving a substrate with distinct areas, where a higher intensity laser beam is used to cut the non-pad area with a functional member, while a lower intensity laser beam is used for the pad area, minimizing carbonization and damage by controlling the cutting process based on the substrate's thickness and surface characteristics.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a uniform high intensity laser beam is used to cut the substrate, then the cutting speed and efficiency are improved, but carbonization and damage occur in the pad area with thinner substrate

Engineering Contradiction:

Improvecutting speedVSAvoidcarbonization and damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies different laser beam intensities to different regions of the substrate: a first intensity for the non-pad area and a second, lower intensity for the pad area. This local differentiation allows efficient cutting in the thicker non-pad region while preventing carbonization and damage in the thinner pad region, resolving the contradiction between cutting speed and harmful effects.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The cutting process is segmented into two distinct zones: a first cutting line for the non-pad area and a second cutting line for the pad area. Each zone receives customized laser parameters, enabling the system to optimize cutting efficiency in one region while protecting the other region from excessive thermal damage.

Inventive Principle:

Principle #1Segmentation

2Object-affected harmful factors

If a low intensity laser beam is used to cut the substrate, then carbonization and damage are minimized, but the cutting speed and efficiency decrease

Engineering Contradiction:

Improvecarbonization and damageVSAvoidcutting speed

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

The patent implements spatially varying laser intensity parameters matched to the local substrate characteristics. The non-pad area, being thicker and requiring more energy for cutting, receives higher intensity. The pad area, being thinner and susceptible to damage, receives lower intensity. This resolves the contradiction by allowing high speed cutting where safe and gentle cutting where needed.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The laser beam parameters (intensity, power, pulse duration) are dynamically changed based on the cutting location. The system transitions from a first set of parameters for the non-pad area to a second set of parameters for the pad area, optimizing both cutting efficiency and substrate protection in different regions.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If the substrate is cut without considering surface roughness variations, then the manufacturing process is simplified, but cutting precision and quality are compromised

Engineering Contradiction:

Improveprocess simplicityVSAvoidcutting precision

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent recognizes that different regions of the substrate have different surface roughness characteristics and applies corresponding laser parameters. The non-pad area with one surface roughness profile receives different cutting parameters than the pad area with another surface roughness profile, achieving precise cuts that account for local surface variations without overly complicating the overall process.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for precise cutting of the display device substrates, reducing carbonization and damage, especially in the non-pad area with a functional member, while ensuring efficient separation and minimizing substrate and functional member damage.

Implementation Method 1

cutting the substrate and the functional member by irradiating a laser beam along a cutting line extending around a periphery of the first area and the second area

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

minimizing carbonization and damage of a substrate

Methodology Applied

Scientific EffectThermal heating: Heating

Data Source

PatentUS10541388B2Method for fabricating a display device are capable of substantially minimizing damage and carbonization of a substrate

Publication Date: 2020.01.21 SAMSUNG DISPLAY CO LTD

AI summary

A display device and a method of manufacturing the display device are capable of substantially minimizing damage and carbonization of a substrate, the display device including: a substrate including a first area and a second area disposed in a first direction and including at least one layer disposed along a second direction intersecting the first direction; a display layer in the first area of the substrate; a functional member on the display layer in the first area of the substrate; and a driving unit in the second area of the substrate, the driving unit configured to drive the display layer. Said at least one layer includes a first end portion at the first area of the substrate and a second end portion at the second area of the substrate, and the first end portion has a greater surface roughness than a surface roughness of the second end portion.