Laser Substrate Cutting via Segmented Side Line Support
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Solution Overview
Problem
Existing methods for cutting out polygonal areas in substrates using electromagnetic radiation, such as laser cutting, suffer from deformation due to gravity and gas flow forces, leading to inaccurate cuts and adherence of the melt to the cutting edge.
Innovation Solution
The method involves continuing the puncture from an inner region to a starting point spaced from a corner point, dividing the side line into a long and short section, with the cutting line starting from the long section and including the short section as a support before completing the cut, ensuring the surface remains orthogonal to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the puncture is continued to a corner point connecting two side lines, then the cutting line can be completed along all side lines, but the surface deforms due to gravity and gas flow forces causing the cut-out surface to bend downwards
Solution Approach 1:
The side line is divided into two sections: a long side line section and a short side line section. The puncture is continued to a starting point on the long side line section rather than directly to the corner point, creating a segmented approach that provides structural support during cutting and prevents surface deformation.
Solution Approach 2:
The starting point is predetermined on the long side line section before cutting begins. This preliminary positioning establishes a support structure in advance that prevents the cut-out surface from bending downwards during the cutting process, thereby maintaining cutting precision.
2Productivity
If the surface is allowed to deform under gravity and gas flow forces, then the cutting process can be completed faster, but the laser beam hits the surface at non-optimal angles causing imprecise cuts
Solution Approach 1:
By segmenting the side line into long and short sections and positioning the starting point on the long section, the structure maintains rigidity during cutting. This prevents surface deformation that would cause the laser beam to hit at non-optimal angles, thereby maintaining cutting precision while allowing continuous cutting operation.
3Productivity
If the cut-out surface bends downwards, then the material removal might be faster, but the melt adheres to the cutting edge again impairing removal
Solution Approach 1:
The starting point is predetermined on the long side line section before cutting begins. This preliminary positioning establishes a support structure in advance that prevents the cut-out surface from bending downwards during the cutting process, thereby maintaining cutting precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes deformation-related issues, maintaining cutting precision and preventing melt adherence by providing additional support to the cutting edge, resulting in improved cutting quality without prolonging the process.
Implementation Method 1
making an opening in a substrate by means of electromagnetic radiation, for example a laser
Implementation Method 2
the force caused by the gas flow of the process gases, whereby the gas flow is used to quickly discharge the melt
Data Source
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AI summary
The invention relates to a method for creating an opening (1) in a substrate (2) using focused electromagnetic radiation (8). The cutting line (7) to be created for this purpose begins in an area of the surface (4) to be removed, enclosed by the side lines (9, 10, 11, 12), and continues as a puncture (5) to a starting point (13) on the first side line (9). According to the invention, this starting point (13) is spaced apart from a corner point (6). Before the starting point (13) is reached again at the end of the cutting line (7), the remaining solid connection to the short side line section (9b) acts as a stiffener in the sense of a support. A deformation of the largely cut-out surface (4') relative to the remaining part of the substrate (2) therefore follows a bending line (14) that is not parallel to the side line (12), so that the latter remains undeformed.This results in a significantly improved quality of the cutting line (7) without any delay in processing.