Laser-Defined Substrate Holder Etching Without Surface Marks
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Solution Overview
Problem
Etching processes often result in etch marks on substrates due to their fixation in substrate holders, necessitating complex post-treatment steps like trimming or grinding to remove these marks.
Innovation Solution
Irradiate the substrate blank with laser radiation along its outer contour before etching, weakening molecular bonds to facilitate separation from the substrate holder without etch marks, using a system with a laser device and substrate holder designed to control the etching process and catch the separated substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are fixed in a substrate holder during etching, then the etching process can be performed efficiently, but etch marks are created on the substrate surface
Solution Approach 1:
The substrate blank is segmented into a target substrate and a sacrificial substrate holder portion through selective laser irradiation along the contour. The etching medium then selectively removes the sacrificial portion, separating the target substrate from the holder without contact, thus avoiding etch marks while maintaining efficient batch processing
Solution Approach 2:
The harmful contact between the substrate holder and the target substrate is eliminated by extracting the target substrate from the holder region during etching. Laser irradiation creates a separation path along the contour, allowing the target substrate to be taken out from the holder before etching completes, preventing etch mark formation
2Manufacturing precision
If complex post-treatment steps like trimming or grinding are applied, then etch marks are removed, but the process complexity and time increase
Solution Approach 1:
Laser irradiation is applied preliminarily along the substrate contour before etching to create a weakened path. This preliminary action prepares the material for selective removal, enabling automatic separation of the target substrate from the holder without requiring subsequent trimming or grinding operations
3Productivity
If laser radiation is applied to weaken molecular bonds, then etching is accelerated in predetermined regions, but additional equipment is required
Solution Approach 1:
Laser radiation serves as an intermediary that locally modifies the substrate material properties along the contour. This creates a gradient in etchability, allowing the etching medium to selectively and rapidly remove material in irradiated regions while leaving non-irradiated regions intact, thus accelerating the separation process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient production of substrates without etch marks by intensifying the etching effect in predetermined regions, allowing for automatic separation and eliminating the need for post-treatment, thus enhancing process efficiency and precision.
Implementation Method 1
the substrate blank is irradiated with laser radiation along an outer contour of a target substrate prior to treatment with the etching medium
Implementation Method 2
molecular bonds of the substrate material can be weakened or loosened using laser irradiation
Implementation Method 3
the etching effect of an etching medium on the substrate blank is intensified or accelerated in one or more predetermined regions on the substrate blank surface
Data Source
AI summary
A method and a system for substrate etching are disclosed, as well as a substrate holder. A substrate blank is arranged in the substrate holder and a substrate blank surface is treated with an etching medium. Prior to treatment with the etching medium, the substrate blank is irradiated with laser radiation along an outer contour of a target substrate, and therefore during treatment with the etching medium, the target substrate is separated from the substrate blank.