Laser-Modulated Substrate Heating for Uniform Etching Profiles

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Solution Overview

Problem

The challenge of achieving uniform temperature distribution and desired shape in substrate processing due to blurring and non-uniform etching caused by laser beam modulation with Digital Micro-mirror Devices (DMDs) results in non-uniform etching of substrates.

Innovation Solution

A substrate processing method and apparatus using a Digital Micro-mirror Device (DMD) to modulate laser beams, adjusting the ON/OFF states of micromirrors to control the shape and distribution of laser beams, converting Gaussian-type beams to flat top-type, and selectively emitting laser beams to achieve uniform temperature distribution and desired patterns on substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a laser beam with flat top distribution is modulated through a DMD and emitted to a specific area to uniformly heat the area, then the desired shape etching should be achieved, but uniform temperature distribution is not formed due to blurring in the edge region of light

Engineering Contradiction:
Improveetching shape precisionVSAvoidtemperature distribution uniformity
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The patent applies local quality by differentiating the laser intensity distribution across different regions of the irradiated area. Specifically, the laser beam is designed with higher intensity at the center region and lower intensity at the edge regions. This non-uniform local intensity distribution compensates for the blurring effect at edges, ensuring that even with light diffusion, the temperature distribution remains uniform across the entire irradiated area, thereby achieving precise etching shapes.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs parameter changes by modifying the intensity distribution parameter of the laser beam. Instead of using a uniform flat top distribution, the laser intensity is varied spatially with higher values at the center and lower values at the edges. This parameter adjustment compensates for the blurring effect during light emission, maintaining uniform temperature distribution and achieving the desired etching precision.

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If light is emitted to heat a specific area of substrate, then etching can be controlled in various ways, but the edge region of light causes blurring and non-uniform temperature distribution

Engineering Contradiction:
Improveetching control flexibilityVSAvoidtemperature distribution uniformity
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent applies local quality by differentiating the laser intensity distribution across different regions of the irradiated area. Specifically, the laser beam is designed with higher intensity at the center region and lower intensity at the edge regions. This non-uniform local intensity distribution compensates for the blurring effect at edges, ensuring that even with light diffusion, the temperature distribution remains uniform across the entire irradiated area, thereby achieving precise etching shapes.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent applies preliminary anti-action by pre-compensating for the expected blurring effect at light edges through intentional intensity reduction at edge regions before light emission. This preliminary adjustment counteracts the adverse effect of light diffusion, preventing non-uniform temperature distribution and maintaining etching precision throughout the process.

Inventive Principle:
Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective substrate processing by ensuring uniform temperature distribution and precise control over etching, allowing for accurate adjustment of critical dimensions and patterns on substrates.

Implementation Method 1

heating a specific area of the substrate by emitting a laser beam

Methodology Applied
Scientific EffectLight heating: Absorption (EM radiation)

Implementation Method 2

modulating the laser beam using a light modulation unit... adjusting a direction in which the micromirrors each reflect the laser beam

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS20250218781A1Substrate processing method and substrate processing apparatus
Publication Date: 2025.07.03 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US20250218781A1 patent drawing
  • US20250218781A1 patent drawing
  • US20250218781A1 patent drawing

AI summary

The present invention provides a substrate treatment method. The substrate processing method includes: a processing liquid supply step of supplying processing liquid to a substrate; and a heating step of heating a specific area of the substrate by emitting a laser beam, which is generated from a laser source, to the substrate, wherein the heating step may include: a laser modulation step of modulating the laser beam using a light modulation unit; and a laser emission step of emitting the laser beam modulated by the light modulation unit to the specific area.