Laser Substrate Hole Formation via Intermediary Layer
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Solution Overview
Problem
Existing methods for generating holes or wells in substrates often result in surface damage and contamination due to incomplete ejection of material or redeposition, especially when trying to create dense arrays with small pitch, as they require large distances between holes to avoid flashovers.
Innovation Solution
A method involving a substrate sandwiched between two modulation layers, where a focused laser beam heats the substrate and a user-controlled voltage supply applies electrical energy to create holes or wells, with the modulation layers preventing surface contamination and excess heat by controlling the size and shape of the affected region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If voltage is applied to generate holes in arrays, then hole generation is achieved, but large distances between holes are required to avoid flashovers
Solution Approach 1:
The patent introduces an intermediary substance (liquid or gas) that fills the space between holes in the array. This intermediary prevents flashovers by providing a medium that suppresses electrical discharge, allowing holes to be placed at smaller distances while maintaining array integrity and preventing harmful electrical breakdown between adjacent holes.
2Productivity
If laser beam is used to melt substrate material, then hole generation is achieved, but surface contamination and redeposition occur
Solution Approach 1:
The liquid or gas intermediary acts as a barrier between the laser processing zone and the substrate surface. It captures and removes molten material that would otherwise redeposit and contaminate the surface, while allowing the laser to effectively melt and eject material for hole formation. This maintains high productivity while eliminating surface contamination.
Solution Approach 2:
The patent converts the potentially harmful effect of molten material ejection (which causes contamination) into a beneficial process. The intermediary substance captures the ejected material and prevents its harmful redeposition, while the controlled ejection mechanism ensures clean hole walls. The harmful byproduct becomes part of the intermediary medium that protects the surface.
3Manufacturing precision
If voltage is applied to eject material, then hole formation is achieved, but residual tensions remain in the substrate
Solution Approach 1:
The patent changes the physical state parameters of the substrate material by introducing the liquid/gas intermediary and controlling the voltage application. This allows material ejection to occur in a controlled manner that reduces thermal and mechanical stress accumulation, thereby forming high-quality holes with minimal residual tensions in the surrounding substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the controllability and quality of hole formation, allowing for dense arrays with better surface quality and reduced residual tensions, making it suitable for mass production by preventing surface contamination and excess heat.
Implementation Method 1
heating the region using a laser beam, preferably a focused laser beam
Implementation Method 2
applying a voltage of a user-defined magnitude across the region of the substrate, the voltage being sufficient to give rise to an increase in electrical current through the substrate or the region, thereby applying a defined amount of electrical energy to the substrate, and dissipating it from the substrate
Data Source
AI summary
A method of generating a hole or well in an electrically insulating or semiconducting substrate, a hole or well in a substrate generated by this method, and an array of holes or wells in a substrate generated by the method.