In-Process Substrate Imaging for Precise Laser Dividing Lines
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Solution Overview
Problem
Existing laser processing techniques face inefficiencies in imaging the semiconductor substrate during the processing of planned dividing lines, leading to issues such as position shifts and expansion of dividing lines, which affect the precision and efficiency of the processing.
Innovation Solution
A laser processing apparatus and method that integrates an imaging part to capture images of the processing object in real-time during line processing, utilizing the execution period of the laser beam to efficiently image the substrate, and includes control mechanisms to optimize the movement of the laser irradiation position and imaging range to minimize switching times and enhance precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the laser beam is used to process multiple planned dividing lines by reciprocating while changing the dividing line on forward and return paths, then the processing coverage is improved, but the position precision of the dividing line deteriorates due to position shifts and expansion caused by laser irradiation
Solution Approach 1:
The patent implements a feedback mechanism where the imaging part captures images of the processing object during laser processing, and the control unit adjusts the laser beam position based on the captured images. This closed-loop feedback system compensates for position shifts and expansion caused by laser irradiation, maintaining position precision while processing multiple dividing lines.
Solution Approach 2:
The patent changes the timing parameter by capturing images during the laser processing execution period rather than separately before or after processing. This parameter change allows the imaging to occur when the processing state is most relevant, enabling real-time compensation for position shifts and expansion.
2Productivity
If the imaging part is used to capture images of the processing object during line processing, then the imaging efficiency is improved, but the device complexity increases due to integration of imaging components and control mechanisms
Solution Approach 1:
The patent merges the imaging function with the laser processing function by integrating the imaging part into the processing head. This combination allows the imaging part to move together with the laser beam, enabling image capture during the laser processing execution period without requiring separate imaging operations, thus improving imaging efficiency while managing device complexity through functional integration.
3Measurement precision
If the imaging part moves integrally with the laser irradiation position during line processing, then the imaging timing is optimized to capture processing influences, but the switching time between different processing lines increases
Solution Approach 1:
The patent maintains continuous useful action by capturing images during the laser processing execution period itself, rather than pausing the processing to take images. The imaging part moves integrally with the laser beam, allowing continuous image capture throughout the processing of each dividing line, which optimizes the timing for recognizing laser processing influences while minimizing interruptions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for efficient imaging of the processing object, enabling precise recognition of laser processing influences, reducing switching times, and improving the overall efficiency and accuracy of the laser processing technique.
Implementation Method 1
processing a processing line by irradiating a laser beam to the processing line
Data Source
AI summary
The image of the part of the semiconductor substrate overlapping the imaging range is obtained by imaging the imaging range relatively moving with respect to the semiconductor substrate during the execution of the line processing of processing the planned dividing line by irradiating the laser beam to the laser irradiation position while moving the laser irradiation position along the planned dividing line. That is, the execution period of the line processing is effectively utilized to image the semiconductor substrate. In this way, the semiconductor substrate can be efficiently imaged in the laser processing technique for processing the planned dividing line by irradiating the laser beam to the planned dividing line.