Laser Substrate Cutting with Particle Blocking and Cut Detection
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Solution Overview
Problem
Existing substrate processing methods fail to effectively prevent waste particles from attaching to substrates during cutting processes, leading to contamination and inefficiencies in processing time and accuracy.
Innovation Solution
A substrate processing apparatus incorporating a laser, a chuck, and particle blockers, including a lower and upper particle blocker with slits and protrusions, to prevent waste particles from attaching to the substrate, while an optical sensor determines the exact time point for cutting termination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a laser is used to cut the substrate, then cutting precision is improved, but waste particles are generated and attach to the substrate causing contamination
Solution Approach 1:
A particle blocker is introduced as an intermediary component between the laser cutting zone and the substrate. This particle blocker captures waste particles generated during laser cutting before they can attach to the substrate, thereby resolving the contradiction between achieving precise cuts and preventing contamination.
2Reliability
If the laser continues operating after cutting is complete, then processing stability is maintained, but processing time is increased due to unnecessary laser usage
Solution Approach 1:
An optical sensor provides feedback by detecting the reflected laser beam. When the substrate is completely cut, the reflection pattern changes, signaling the control system to terminate laser operation. This feedback mechanism maintains processing stability during cutting while preventing unnecessary continued operation that would waste time.
3Measurement precision
If the optical sensor is positioned to detect reflected light, then cutting completion detection accuracy is improved, but the system complexity increases
Solution Approach 1:
The optical sensor utilizes the laser beam's own reflection from the substrate to detect cutting completion. The substrate itself serves as the reflector, and the sensor detects changes in the reflected light pattern. This self-service approach achieves high detection accuracy without requiring additional complex external illumination systems or sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents substrate contamination, allows for accurate determination of cutting completion, and reduces processing time by ensuring precise cutting and minimizing unnecessary laser usage.
Implementation Method 1
a laser that directs a laser beam toward a substrate
Implementation Method 2
an optical sensor that detects a light beam reflected from the polarizing beam splitter
Data Source
AI summary
Embodiments of a substrate processing apparatus and substrate processing method are provided. Embodiments include a laser that directs a laser beam toward a substrate. Embodiments further include a chuck spaced apart in a first direction from the laser. Embodiments include a lower particle blocker disposed between the chuck and the laser. In some cases, the lower particle blocker includes a first particle blocker. In some cases, the first particle blocker includes a first slit that penetrates the first particle blocker in the first direction. In some cases, the first slit extends in a second direction perpendicular to the first direction.