Laser Substrate Separation with Feedback Completion Detection
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Solution Overview
Problem
Existing methods for separating a target layer from a substrate using a separation layer and laser light are inefficient and lack precision in determining the completion of the separation process.
Innovation Solution
A separating system comprising a placing unit, removing apparatus, and transfer device that uses laser light to remove the separation layer and a control device to determine the separation state, ensuring efficient and precise separation of substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser light is used to remove the separation layer, then the separation process becomes more precise, but the system complexity increases due to the need for additional apparatus and control mechanisms
Solution Approach 1:
The system is divided into distinct functional modules: a placing unit with multiple cassettes for substrate storage, a removing apparatus for laser-based separation layer removal, and a transfer device for substrate handling. This segmentation allows each component to be optimized independently while maintaining overall system precision.
Solution Approach 2:
The control device monitors the separation process and determines when the separation is complete, providing feedback control to the laser removal apparatus. This ensures precise separation while automating the process to manage system complexity.
2Productivity
If a automated separating system with multiple cassettes and transfer devices is implemented, then productivity increases, but the device complexity increases
Solution Approach 1:
Multiple cassettes (first, second, and third cassettes) are integrated into a single placing unit, and the transfer device combines substrate transfer and positioning functions. This merging reduces the number of separate components needed, improving productivity while controlling overall system complexity.
Solution Approach 2:
The transfer device serves multiple functions: transferring substrates between cassettes, positioning substrates for laser removal, and coordinating with the control device. This multi-functionality increases productivity without requiring separate dedicated apparatus for each operation.
3Speed
If laser light is used to remove the separation layer, then the separation speed increases, but the energy consumption increases
Solution Approach 1:
The laser removal apparatus operates with periodic laser pulses rather than continuous radiation. The control device regulates the timing and duration of laser pulses to efficiently remove the separation layer at high speed while minimizing total energy consumption through pulsed operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves efficient and precise separation of substrates by using laser light to remove the separation layer and includes a control device to ensure complete separation, thereby improving process efficiency.
Implementation Method 1
The removing apparatus is configured to remove the separation layer by radiating laser light to the combined substrate
Data Source
AI summary
A separating system includes a placing unit, a removing apparatus and a transfer device. The placing unit is configured to place therein a first cassette allowed to accommodate a combined substrate in which a first substrate and a second substrate are bonded to each other with a separation layer therebetween, a second cassette allowed to accommodate the first substrate, and a third cassette allowed to accommodate the second substrate. The removing apparatus is configured to remove the separation layer by radiating laser light to the combined substrate. The transfer device is configured to perform a processing of transferring the combined substrate to the removing apparatus and a processing of transferring the first substrate and the second substrate separated from the combined substrate to the placing unit.