Laser Irradiation Apparatus Substrate Stage Pusher Pin Dynamics
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Solution Overview
Problem
Existing laser irradiation apparatuses face challenges in achieving accurate substrate processing due to low followability of the substrate stage with the movement of the base flange and stage, leading to potential inaccuracies in substrate positioning and processing.
Innovation Solution
The apparatus includes a substrate stage fixed to a base flange with a motor-driven pusher pin and pusher blade system that moves up and down to support the substrate, allowing for precise positioning and rotation, thereby improving the accuracy of substrate processing by maintaining a stable interface between the substrate and the stage during laser irradiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the substrate stage uses a simple support structure, then the device complexity is reduced, but the followability with base flange movement deteriorates, leading to positioning inaccuracies
Solution Approach 1:
The substrate stage is designed with dynamic support mechanisms including pusher pins and pusher blades that can move up and down to actively follow the base flange movement, transforming a static simple structure into a dynamic adaptive system that maintains positioning accuracy without excessive complexity
Solution Approach 2:
Pusher pins and pusher blades are introduced as intermediary elements between the substrate stage and base flange, mediating the movement transmission and ensuring accurate followability while keeping the overall structure relatively simple
2Ease of manufacture
If the substrate stage structure is simplified, then ease of manufacture is improved, but substrate support stability deteriorates, causing warpage and damage
Solution Approach 1:
The support function is segmented into multiple independent pusher pins and pusher blades distributed across the substrate stage, allowing each element to be simple to manufacture while collectively providing stable, distributed support that prevents substrate warpage and damage
Solution Approach 2:
Different local regions of the substrate stage are equipped with specific support elements (pusher pins at certain locations, pusher blades at others) to provide locally optimized support that prevents warpage while maintaining overall manufacturing simplicity
Data Source
AI summary
To realize a laser irradiation apparatus by using which accuracy in processing a substrate can be improved. A laser irradiation apparatus according to an embodiment includes a laser irradiation unit configured to apply laser light to a substrate, a base part, and a conveyance stage configured to convey the substrate. The conveyance stage includes a stage configured to be movable over the base part, a base flange fixed over the stage, a substrate stage fixed to an upper end part of the base flange and configured so that the substrate is placed thereover, and a pusher pin for supporting the substrate, the pusher pin being configured to penetrate the substrate stage and to be movable up and down.