Laser Module Packaging on Common Substrate
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Solution Overview
Problem
Conventional packaging of optical components in laser modules is expensive and difficult to manufacture due to lack of practical mounting surfaces on common planes, complicating component alignment within tight tolerances and requiring inefficient heat management and temperature control.
Innovation Solution
Packaging the laser module's optical elements, frequency converter, and surface-emitters on a common substrate, allowing for precise alignment using semiconductor-type equipment and integrated temperature control, with a selective reflector aligned based on optical output, and using insulative materials for thermal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional packaging methods are used for laser module optical components, then component alignment within tight tolerances becomes complicated and expensive, but manufacturing cost and difficulty increase
Solution Approach 1:
The patent merges multiple optical components (surface-emitting laser, frequency-doubling crystal, optical elements, selective reflector) onto a single common substrate. This integration eliminates the need for separate mounting surfaces and complex alignment procedures between discrete components, thereby improving manufacturing precision while reducing manufacturing difficulty and cost.
Solution Approach 2:
The common substrate serves multiple functions simultaneously: it acts as the mounting surface for all optical components, provides thermal management capabilities through integrated temperature control, and establishes precise spatial relationships between components. This multi-functionality resolves the contradiction by simplifying the manufacturing process while maintaining tight alignment tolerances.
2Temperature
If conventional packaging is used, then heat management and temperature control become inefficient, but manufacturing complexity increases
Solution Approach 1:
The patent combines temperature control functionality directly into the common substrate that holds all optical components. This integration allows for efficient heat management through the substrate's thermal properties while reducing packaging complexity by eliminating separate temperature control mechanisms for each component.
Solution Approach 2:
The common substrate acts as an intermediary that facilitates both mechanical support and thermal management. It mediates between the heat-generating laser components and the external environment, providing efficient heat dissipation pathways while simplifying the overall device architecture and reducing packaging complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates cost-effective and precise manufacturing of laser modules with improved heat management and alignment, enabling efficient production of visible light for display applications.
Implementation Method 1
a frequency-doubling crystal, form a laser module capable of producing sufficient visible light
Data Source
AI summary
In one embodiment, a laser module comprising an optical element, a frequency converter, a selective reflector, and one or more surface-emitters, each coupled to a common substrate, wherein the emitters, the optical element, the frequency converter, and the selective reflector are positioned with respect to each other such that at least a portion of the coherent light emitted from the surface-emitters travels through the optical element, through the frequency converter and through the selective reflector. In a method embodiment, a method for frequency converting light generated by a surface-emitter, wherein the light passes through an optical element, a frequency converter, and a selective reflector, each coupled to a common substrate.