Laser Light Source Support Structure for Precise Optical Alignment

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Solution Overview

Problem

Existing laser light sources face challenges in aligning optical members due to thermal interference from substrates with high thermal conductivity, which can lead to improper bonding and reduced precision in optical alignment.

Innovation Solution

Incorporating supporting members with lower thermal conductivity than the substrate, these members are secured to the substrate and bonded with optical members using a bonding layer, allowing for precise alignment and curing of the bonding layer through laser heating without thermal interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a substrate with high thermal conductivity is used to support semiconductor laser devices, then heat dissipation is improved, but thermal interference occurs during bonding process affecting optical member alignment precision

Engineering Contradiction:

Improveheat dissipationVSAvoidoptical member alignment precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The support structure is segmented into two distinct parts: a substrate for heat dissipation and a supporting member for precise positioning. The substrate (first support structure) has high thermal conductivity to dissipate heat from semiconductor laser devices, while the supporting member (second support structure) has low thermal conductivity to minimize thermal interference during bonding, thereby resolving the contradiction between heat dissipation and alignment precision

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the support structure are assigned different thermal conductivity properties according to their specific functions. The substrate region requires high thermal conductivity for heat dissipation, while the supporting member region requires low thermal conductivity for precise optical alignment during bonding. This local differentiation of material properties resolves the thermal interference issue while maintaining effective heat dissipation

Inventive Principle:

Principle #3Local quality

2Ease of manufacture

If adhesive filling is performed through a hole extending through the heat sink, then bonding is achieved, but alignment of optical members becomes difficult

Engineering Contradiction:

Improvebonding processVSAvoidoptical member alignment

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The support structure is divided into a substrate for bonding and a supporting member for alignment. The supporting member protrudes from the substrate and provides a dedicated alignment surface for optical members, allowing precise positioning before bonding. This segmentation enables both easy bonding through the hole and precise alignment of optical members

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The supporting member is pre-positioned on the substrate before optical members are installed. This preliminary action creates a reference structure that guides the precise placement of optical members. The alignment surface of the supporting member is prepared in advance, allowing optical members to be accurately positioned before the bonding process occurs

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method facilitates active alignment and accurate positioning of optical members, enhancing the precision and efficiency of the laser light source by minimizing thermal interference and ensuring proper bonding.

Implementation Method 1

a bonding layer located between the at least one of the plurality of optical members and the supporting member, the bonding layer bonding together the at least one of the plurality of optical members and the supporting member

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The supporting member has a lower thermal conductivity than a thermal conductivity of the substrate

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20230344194A1Laser light source and method of manufacturing the same

Publication Date: 2023.10.26 NICHIA CORP

AI summary

A laser light source includes: a substrate having an upper face and a lower face; one or more semiconductor laser devices configured to emit laser light, the one or more semiconductor laser devices being supported by the upper face of the substrate; a plurality of optical members configured to reflect or transmit the laser light; a supporting member secured to the substrate, the supporting member supporting at least one of the plurality of optical members; and a bonding layer located between the at least one of the plurality of optical members and the supporting member, the bonding layer bonding together the at least one of the plurality of optical members and the supporting member. A thermal conductivity of the supporting member is lower than that of the substrate.