Non-Contact Plate Support for Laser Cutting Waviness Control
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Solution Overview
Problem
Conventional laser processing apparatuses face challenges in cutting plate materials with precision due to waviness, which can cause variations in the focal length of the laser head, and existing solutions like using a brush to straighten the material may damage soft materials like aluminum alloys.
Innovation Solution
A laser processing apparatus with a non-contact support unit that suctions the plate material's lower surface using a suction surface without direct contact, combined with rotatable rollers and a dust collecting unit that follows the laser head, allowing for precise cutting while removing waviness without damaging the material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a brush is used to press the plate material to remove waviness, then the distance between the laser head and plate material can be maintained constant, but the surface of soft plate material may be scratched, reducing yield and increasing cost
Solution Approach 1:
The patent replaces the mechanical brush-based waviness removal system with a magnetic field-based system. A magnet is positioned between the laser head and the plate material to apply magnetic force that removes waviness without mechanical contact, thereby eliminating surface scratching while maintaining cutting precision
Solution Approach 2:
The patent introduces a magnet as an intermediary element between the laser head and the plate material. This magnet serves as a mediator that applies force to remove waviness without direct contact between the laser head and material, preventing surface damage while enabling precise cutting
2Productivity
If the plate material is conveyed without sufficient waviness removal, then the material can be fed continuously, but the distance between laser head and plate material varies, causing focal length variation and poor cutting precision
Solution Approach 1:
The patent replaces mechanical contact-based waviness removal with magnetic force application, enabling continuous material feeding while maintaining consistent laser-to-material distance and cutting precision through non-contact magnetic field action
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise cutting of plate materials by removing waviness without surface damage, maintaining consistent focal length and improving processing accuracy and yield.
Implementation Method 1
a non-contact support unit (for example, a non-contact support pad 7 described later) is provided at an opening (for example, an opening 61 described later) of the dust collecting unit, and the non-contact support unit suctions a lower surface (for example, a suction surface 71 described later) of the plate material toward a suction surface and supports the plate material without bringing the lower surface of the plate material and the suction surface into contact with each other
Data Source
AI summary
A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.