Laser Processing Imaging During Beam Direction Switching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing laser processing techniques for semiconductor substrates face inefficiencies due to the influence of switching periods when changing the direction of the laser beam, which prolongs the processing time.
Innovation Solution
A laser processing apparatus and method that utilizes a processing-axis driver and a feeding-axis driver to manage the laser irradiation position, incorporating reverse drives and continuous feed drives to minimize the impact of switching periods by optimizing the movement of the laser beam between processing lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the laser beam reciprocates between forward and return paths to process multiple processing lines, then all processing lines can be processed in turn, but a switching period occurs that prolongs the overall processing time
Solution Approach 1:
The imaging part continues to image the processing object during the switching period when the laser beam moves from the forward path to the return path. This allows the imaging function to be performed continuously without interruption, while the laser processing maintains its reciprocating motion pattern. By utilizing the switching period for imaging operations, the overall processing time is reduced as these operations occur concurrently rather than sequentially.
2Speed
If the laser irradiation position is moved rapidly between processing lines, then the processing speed increases, but the positioning precision may be compromised during direction changes
Solution Approach 1:
The imaging part performs imaging operations in advance during the switching period before the laser beam reaches the next processing line. This preliminary action ensures that the position information is captured and ready before the laser irradiation begins, allowing for precise positioning without compromising the high-speed reciprocating motion of the laser beam.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively utilizes switching periods to reduce the overall processing time by aligning and imaging the processing object, thereby enhancing the efficiency of laser processing on semiconductor substrates.
Implementation Method 1
an imaging part imaging a predetermined imaging range relatively moving with respect to the processing object integrally with the laser irradiation position
Data Source
AI summary
The semiconductor substrate is imaged by the imaging part for imaging the imaging range relatively moving with respect to the semiconductor substrate integrally with the laser irradiation position as the laser irradiation position relatively moves with respect to the semiconductor substrate. In particular, the imaging range is located on the side of the laser irradiation position in the direction and the imaging part images the part (imaging point) of the semiconductor substrate overlapping the imaging range in the switching period. In this way, the switching period is effectively utilized to image the semiconductor substrate. As a result, it is possible to suppress an influence of the switching period for switching the moving direction of the laser beam on a time required to complete the processing of the semiconductor substrate.