Semiconductor Laser Temperature Sensing With Wire Heat Capacity Buffer
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Solution Overview
Problem
Existing semiconductor laser devices face challenges in accurately controlling the temperature of the semiconductor laser element due to measurement errors caused by heat transfer from pin terminals through electrically conductive wires to the temperature detection part.
Innovation Solution
The semiconductor laser device incorporates a heat capacity increasing part that contacts the wire connecting the temperature detecting element and the output terminal, thereby increasing the heat capacity of the wire and reducing heat transfer to the temperature detecting element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrically conductive wires connect pin terminals to the temperature detection part, then electrical connection is achieved, but heat transfers from pin terminals through wires to the temperature detection part causing measurement error
Solution Approach 1:
The patent introduces a heat capacity increasing part as an intermediary component between the wire and the temperature detection part. This mediator absorbs excess heat from the wire, preventing it from reaching the temperature detection part and causing measurement errors, while allowing the wire to maintain its electrical connection function.
Solution Approach 2:
The patent changes the thermal parameter (heat capacity) of the system by adding the heat capacity increasing part. This modifies the heat transfer characteristics, allowing the wire to conduct electricity while the increased heat capacity absorbs thermal energy that would otherwise reach the temperature sensor and corrupt measurements.
2Measurement precision
If the temperature of the semiconductor laser element is not accurately controlled, then wavelength variation occurs affecting analysis accuracy, but adding heat capacity increasing part increases device complexity
Solution Approach 1:
The heat capacity increasing part serves as a simple intermediary component that improves wavelength control precision by enabling accurate temperature measurement. The added complexity is minimal (a single component) compared to the significant improvement in measurement precision and analysis accuracy achieved.
Solution Approach 2:
By changing the thermal parameter (adding heat capacity) at a specific location, the patent achieves better wavelength control precision without substantially increasing overall device complexity. The modification is localized and targeted, affecting only the thermal management of the temperature detection pathway.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for accurate detection of the semiconductor laser element's temperature, enabling highly accurate control of the semiconductor laser element's temperature and reducing wavenumber variation, which is particularly beneficial for optical analysis applications like infrared spectroscopic analysis.
Implementation Method 1
there is provided the heat capacity increasing part that contacts with the wire connecting the temperature detecting element and the output terminal to increase the heat capacity of the wire
Implementation Method 2
heat is transferred to the temperature detection part from pin terminals through electrically conductive wires
Implementation Method 3
a temperature detection part such as a thermistor to control the temperature control part on the basis of temperature obtained by the temperature detection part
Implementation Method 4
a temperature control part including a Peltier element
Data Source
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AI summary
The present invention relates to a semiconductor laser device capable of reducing a measurement error of a temperature detecting element for detecting the temperature of a semiconductor laser element and accurately controlling the temperature of the semiconductor laser element. The semiconductor laser device is used for optical analysis and includes: a semiconductor laser element 2; a temperature detecting element 3 that detects the temperature of the semiconductor laser element 2; output terminals T1 and T2 that output the output of the temperature detecting element 3 to the outside; wires L1 and L2 that electrically connect the temperature detecting element 3 and the output terminals T1 and T2; and a heat capacity increasing part 7 that is provided interposed between the temperature detecting element 3 and output terminal T1, and the output terminal T2, and contacts with at least part of the wires L1 and L2 to increase the heat capacity of the wires L1 or L2.