Laser Textured Plasma Chamber Component Coating Adhesion
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Solution Overview
Problem
Plasma processing chambers face issues with protective coating delamination and residue deposition, leading to contamination and device failure due to the harsh plasma environment and temperature fluctuations, which existing mechanical surface roughening methods cannot adequately address without causing additional damage.
Innovation Solution
The use of laser texturing to create a patterned surface on components within the plasma processing chamber, increasing the adhesion of protective coatings and reducing delamination, while also enhancing the attachment of plasma processing residue, thereby minimizing contaminant generation and surface damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective coating is applied to protect a component in a plasma processing chamber, then the component is protected from plasma damage, but the protective coating may delaminate from the component due to plasma environment and temperature swings
Solution Approach 1:
The component surface is laser textured before applying the protective coating. This preliminary surface modification creates a patterned surface with increased surface area and mechanical interlocking features, which prepares the surface to better withstand plasma and temperature conditions during subsequent operation.
Solution Approach 2:
The solution combines the component material with a protective coating material to form a composite structure. The laser texturing process further modifies this composite by creating a patterned interface between the component and coating, enhancing their combined performance in the plasma environment.
2Stability of the object's composition
If mechanical surface roughening is used to increase coating adhesion, then coating delamination is reduced, but additional surface damage is caused
Solution Approach 1:
The patent replaces mechanical surface roughening methods with laser texturing. The laser process uses optical energy to create the surface pattern without mechanical contact, thereby avoiding the additional surface damage that would be caused by mechanical abrasion or roughening tools.
Solution Approach 2:
The laser texturing process allows precise control of surface pattern parameters such as pattern size, depth, and density. By optimizing these parameters, the surface is modified to maximize coating adhesion while minimizing surface damage, unlike mechanical methods which are less controllable.
3Productivity
If residue deposits on component surfaces, then plasma processing occurs, but the residue may flake off becoming a contaminant causing device failure
Solution Approach 1:
The component surface is laser textured before plasma processing to create a patterned surface that enhances residue attachment. This preliminary surface modification ensures that residue deposits during plasma processing will adhere more strongly and are less likely to flake off and become contaminants.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Laser texturing significantly increases the adhesion between the protective coating and the component surface, reducing adhesive failure and increasing cohesive failure, thus minimizing contaminant generation and surface damage, while providing a more precise and controlled texturing that is not achievable through mechanical methods.
Implementation Method 1
The vacuum facing surface of the component is laser ablated to form a laser textured surface
Implementation Method 2
the CTE of the component body material is closer to the CTE of the first material than the CTE of the second material, and where the CTE of the protective coating material is closer to the CTE of the second material than the CTE of the first material
Data Source
AI summary
A component for use inside a semiconductor chamber with a laser textured surface facing a vacuum region inside the semiconductor chamber is provided.


