Laser Textured Photovoltaic Semiconductor Devices

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Solution Overview

Problem

Traditional methods for making photovoltaic semiconductor devices involve suboptimal processing steps that result in non-uniform surface textures and inefficient electromagnetic radiation absorption, leading to reduced device quality and performance.

Innovation Solution

The method involves applying a damage removal etch to create a smooth surface and using laser radiation to texture and dope the semiconductor material, allowing for precise control over surface features and dopant localization, thereby enhancing electromagnetic radiation absorption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If traditional processing steps are used to texture the semiconductor surface, then surface texturing is achieved, but the surface texture becomes non-uniform and electromagnetic radiation absorption efficiency decreases

Engineering Contradiction:
Improvesurface texture uniformityVSAvoidelectromagnetic radiation absorption efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent replaces traditional mechanical or chemical texturing methods with laser radiation processing. The laser creates uniform surface features through controlled irradiation, eliminating the non-uniformity associated with conventional processing while enhancing electromagnetic radiation absorption through precisely controlled surface morphology.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes controlled laser radiation parameters (wavelength, intensity, pulse duration) to create optimal surface features. By adjusting these parameters, uniform surface texturing is achieved that maximizes electromagnetic radiation absorption, resolving the contradiction between manufacturing precision and absorption efficiency.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If multiple processing steps including oxide removal and antireflective coating are applied, then device quality is improved, but processing time increases

Engineering Contradiction:
Improvedevice qualityVSAvoidprocessing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent combines multiple functions into the laser processing step. The laser radiation simultaneously performs surface texturing, doping, and antireflective coating functions in a single operation, eliminating the need for separate oxide removal and coating steps while maintaining device quality.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The laser processing system is designed to perform multiple functions: surface texturing for light trapping, dopant incorporation for electrical properties, and antireflective coating formation. This multi-functional approach reduces processing time while maintaining comprehensive device quality improvement.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Productivity

If laser radiation is used to texture and dope the semiconductor material, then electromagnetic radiation absorption is enhanced, but processing complexity increases

Engineering Contradiction:
Improveelectromagnetic radiation absorption efficiencyVSAvoidprocessing complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies laser radiation with localized control to create specific surface features and dopant distributions where needed. This localized processing enhances electromagnetic radiation absorption in critical regions without requiring complex overall processing schemes, maintaining simplicity while achieving high efficiency.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in higher quality semiconductor devices with improved crystalline defect gettering, increased efficiency, and reduced processing time, allowing for the elimination of unnecessary steps like oxide removal and antireflective coating, leading to better light absorption and device performance.

Implementation Method 1

texturing further includes irradiating a target region of the semiconductor material with laser radiation

Methodology Applied
Scientific EffectLaser irradiation: Laser

Implementation Method 2

exposing the laser radiation to a dopant such that the irradiation incorporates the dopant into the semiconductor material

Methodology Applied
Scientific EffectDopant incorporation: Ion Implantation

Implementation Method 3

The quality of the semiconductor device can be improved by annealing the semiconductor material and/or the textured region

Methodology Applied
Scientific EffectAnnealing: Annealing

Implementation Method 4

the dopant can be activated at a temperature of greater than about 700° C.

Methodology Applied
Scientific EffectDopant activation: Heat Treatment

Implementation Method 5

applying a damage removal etch (DRE) to a semiconductor material to create at least one surface having a root mean square (RMS) surface roughness

Methodology Applied
Scientific EffectEtching: Ablation

Implementation Method 6

Photovoltaic semiconductor devices and associated methods

Methodology Applied
Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Implementation Method 7

enhanced electromagnetic radiation absorption

Methodology Applied
Scientific EffectElectromagnetic radiation absorption: Absorption (EM radiation)

Data Source

PatentUS8309389B1Photovoltaic semiconductor devices and associated methods
Publication Date: 2012.11.13 SIONYX INC
  • US8309389B1 patent drawing
  • US8309389B1 patent drawing
  • US8309389B1 patent drawing

AI summary

Photovoltaic semiconductor devices and associated methods are provided. In one aspect, for example, a method of making a photovoltaic semiconductor device having enhanced electromagnetic radiation absorption can include applying a damage removal etch (DRE) to a semiconductor material to an RMS surface roughness of from about 0.5 nm to about 50 nm and texturing a single side of the semiconductor material. The texturing further includes irradiating a target region of the semiconductor material with laser radiation to create features having a size of from about 50 nm to about 10 microns.