Laser-Textured Metal Sealing Surface for Resin Adhesion
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Solution Overview
Problem
The existing bonding techniques between a resin member and a metal surface in semiconductor devices are inadequate, leading to insufficient adhesion and potential failures due to internal stress, especially at joints where high stress concentrations occur.
Innovation Solution
A method involving laser beam irradiation to create a rough surface with circular marks on a support member's sealing surface, enhancing bonding by increasing the density of marks in high-stress areas, and using a post-processing laser with lower energy to improve wettability in critical boundary areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding techniques are used between resin member and metal surface, then the manufacturing process is simple, but the adhesion strength is insufficient and peeling occurs due to internal stress
Solution Approach 1:
The metal surface is subjected to laser irradiation treatment before bonding to create a roughened surface with increased surface area. This preliminary surface modification enhances adhesion strength by providing mechanical interlocking features that prevent peeling under internal stress, while the automated laser process keeps complexity manageable
Solution Approach 2:
The laser irradiation is applied selectively to specific regions of the metal surface where high adhesion strength is critical, creating localized roughened areas with enhanced bonding characteristics. This allows concentrated improvement in critical zones without unnecessarily complicating the entire surface treatment process
2Strength
If laser beam irradiation is used to create rough surface with high density marks, then bonding strength improves, but processing time increases
Solution Approach 1:
The laser irradiation parameters are optimized to create appropriate surface roughness in critical bonding areas without over-processing. By concentrating laser marks in regions requiring enhanced bonding while maintaining faster processing speeds in less critical areas, the overall processing time is reduced while still achieving sufficient bonding strength
Solution Approach 2:
The laser processing parameters (energy density, scan speed, pulse duration) are optimized to achieve effective surface roughening with minimal processing time. By adjusting these parameters, the process creates adequate adhesion enhancement without excessive processing duration, balancing bonding strength requirements with manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the bonding between the resin member and the metallic sealing surface, reducing the risk of failures like peeling and enhancing the overall adhesion, while maintaining efficient processing and minimizing increased processing time.
Implementation Method 1
A method involving laser beam irradiation to create a rough surface with circular marks on a support member's sealing surface
Implementation Method 2
using a post-processing laser with lower energy to improve wettability in critical boundary areas
Data Source
AI summary
An electronic device includes: a support member that has a metallic placement surface joined to the conductive bonding layer, and a metallic sealing surface provided on an outer side of the placement surface in an in-plane direction of the placement surface to adjoin the placement surface and to surround the placement surface; and a resin member, which is a synthetic resin molded article, joined to the sealing surface and covering the electronic component. The sealing surface includes a rough surface having a plurality of laser irradiation marks having a substantially circular shape. The rough surface includes a first region and a second region. The second region has a higher density of the laser irradiation marks in the in-plane direction than the first region.