Laser Texturing of Chamber Components With Liquid-Masked Holes
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Solution Overview
Problem
Existing methods for refurbishing semiconductor process chamber components, particularly non-planar surfaces like holes, struggle to completely remove laser-induced texturing, leading to residual surface roughness that cannot be polished away.
Innovation Solution
A method involving partial submersion of the component in a liquid, where a first portion is not submerged and a second portion is submerged, and then contacting the first portion with a laser beam to texture it to a specific surface roughness, while minimizing or avoiding texturing of the second portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser texturing is applied to the entire surface including non-planar areas, then the planar surface achieves the desired roughness, but the non-planar areas (holes) cannot be completely removed by polishing and retain residual roughness
Solution Approach 1:
The patent applies different surface treatments to different portions of the component. The planar surface receives full laser texturing to achieve high roughness (Ra ≥ 50 nm), while the non-planar areas (holes) are either not textured or textured to a lesser degree (Ra < 10 nm). This local differentiation ensures that only the planar surfaces contribute to particle generation, while non-planar areas remain smooth and particle-free.
Solution Approach 2:
The component surface is divided into two distinct zones: a first portion (planar surface) that is fully textured, and a second portion (non-planar areas with holes) that is either not textured or minimally textured. This segmentation allows selective application of the laser treatment to achieve different surface properties in different regions, resolving the contradiction between achieving high roughness on planar surfaces and maintaining smoothness on non-planar surfaces.
2Manufacturing precision
If the component is completely submerged in liquid, then the laser beam cannot effectively texture the surface due to liquid interference, but if not submerged, then the entire surface including non-planar areas is textured
Solution Approach 1:
The patent extracts or removes the liquid from specific areas where laser texturing is desired. By partially submerging the component, the liquid is taken out from the first portion (planar surface) allowing effective laser texturing, while the second portion (non-planar areas) remains submerged to prevent texturing. This selective removal of the liquid medium enables precise control over which areas are textured.
Solution Approach 2:
The liquid acts as an intermediary that selectively blocks or permits laser beam interaction with different portions of the component. By controlling the liquid level and component positioning, the liquid mediates the laser-texturing process, allowing texturing on exposed planar surfaces while protecting submerged non-planar areas from texturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively textures the planar surfaces of semiconductor process chamber components to a high surface roughness while maintaining a lower surface roughness on non-planar areas, thereby enhancing the refurbishment process and reducing defects in integrated circuits.
Implementation Method 1
contacting at least the first portion of the component with a laser beam at a power and for a period of time sufficient to texture the first portion of the component
Data Source
AI summary
Methods for texturing a surface of a component which include partially submerging the component within a liquid such that a first portion of the component is not submerged in the liquid and a second portion of the component is submerged in the liquid; and contacting at least the first portion of the component with a laser beam at a power and for a period of time sufficient to texture the first portion of the component to a first surface roughness, wherein the second portion of the component is either not textured by the laser beam, or is textured to a lesser degree than the first portion of the component and has a second surface roughness which is less than the first surface roughness.