Laser Texturing of Chamber Components With Selective Liquid Submersion
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Solution Overview
Problem
Existing methods struggle to effectively texture non-planar surfaces of semiconductor process chamber components, such as holes in a showerhead faceplate, due to incomplete removal by polishing, leading to potential particle shedding and defects in integrated circuits.
Innovation Solution
A method and apparatus that partially submerge the component in a liquid, ensuring a first portion remains dry while a second portion is submerged, and use a laser beam to texture the exposed portion to a specific roughness, while minimizing laser impact on the submerged portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser texturing is applied to the entire surface including non-planar areas, then the planar surface achieves the desired roughness, but the non-planar areas (holes) cannot be completely removed of texturing by polishing
Solution Approach 1:
The patent applies different surface treatments to different portions of the component. The planar surface receives full laser texturing and polishing to achieve uniform roughness, while the non-planar areas (holes) are either not textured or textured to a lesser degree, preserving their smoothness to prevent particle shedding. This local differentiation resolves the contradiction between achieving uniform surface quality and preventing particle generation.
2Manufacturing precision
If polishing is applied to remove laser texturing from non-planar surfaces, then the surface smoothness improves, but the texturing cannot be completely removed from holes and recesses
Solution Approach 1:
The patent performs preliminary laser texturing selectively before polishing. By controlling the laser to either avoid non-planar areas or apply minimal texturing to holes and recesses, the component is pre-conditioned such that subsequent polishing can effectively maintain smooth surfaces in these critical areas without leaving residual texturing that would cause particle shedding.
3Temperature
If the component is completely submerged in liquid during laser texturing, then cooling and particle removal improve, but the laser beam cannot effectively texture the surface
Solution Approach 1:
The patent applies different liquid exposure conditions to different portions of the component during laser texturing. The planar surface is either exposed to air or receives minimal liquid coverage to allow effective laser texturing, while non-planar areas are submerged or covered with liquid to provide cooling and capture debris. This spatial differentiation of liquid application resolves the contradiction between laser effectiveness and thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves differential surface roughness on planar and non-planar areas, preventing particle shedding and enhancing component durability, thereby reducing defects in integrated circuits.
Implementation Method 1
contacting at least the first portion of the component with a laser beam at a power and for a period of time sufficient to texture the first portion of the component
Implementation Method 2
partially submerging the component within a liquid
Data Source
AI summary
Methods for texturing a surface of a component which include partially submerging the component within a liquid such that a first portion of the component is not submerged in the liquid and a second portion of the component is submerged in the liquid; and contacting at least the first portion of the component with a laser beam at a power and for a period of time sufficient to texture the first portion of the component to a first surface roughness, wherein the second portion of the component is either not textured by the laser beam, or is textured to a lesser degree than the first portion of the component and has a second surface roughness which is less than the first surface roughness.