Laser Thermal Flow Circuit for Uniform Galvanometer Cooling
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Solution Overview
Problem
Conventional additive manufacturing systems face challenges in achieving precise temperature control and distribution for electromagnetic radiation emission systems, leading to thermal drift and instability, which affects the accuracy and precision of laser components like galvanometers.
Innovation Solution
A thermal control apparatus and system that incorporates a heat transfer fluid flow circuit with a parallel flow arrangement around the laser system, including a body with an internal flow circuit and turbulator structures to ensure uniform heat transfer and reduce thermal gradients, along with a controller to actively manage the flow and temperature of the heat transfer fluid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If preset gas flows or large reservoirs with high flow rates are used to cool laser components, then temperature control is achieved, but gas usage becomes excessive and packaging efficiency is reduced
Solution Approach 1:
The patent applies local quality by directing cooling gas flow specifically to components requiring thermal control (galvanometer, laser box, mirror mounts) rather than using uniform high flow rates throughout the entire system. The flow circuit is designed to deliver cooling gas locally where thermal drift occurs, reducing overall gas consumption while maintaining effective temperature control at critical components.
2Temperature
If conventional cooling systems with large reservoirs are used, then temperature control is achieved, but device complexity and packaging efficiency are reduced
Solution Approach 1:
The patent implements nesting by integrating the cooling flow circuit directly within the laser box structure. The flow circuit is nested within the existing housing, eliminating the need for separate large external reservoirs and complex piping systems. This integrated approach reduces device complexity while maintaining effective thermal control.
3Stability of the object's composition
If uniform cooling is applied to all laser components, then thermal stability is improved, but thermal gradients necessary for certain optical paths are reduced
Solution Approach 1:
The patent applies local quality by providing targeted cooling to specific components (galvanometer, laser box, mirror mounts) that require thermal stability for accurate beam positioning, while allowing other components to maintain thermal gradients necessary for optical path control. The flow circuit is configured to deliver cooling gas selectively to components where thermal drift would most affect beam pointing accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution mitigates thermal shift and instability in laser components, improving beam pointing accuracy and maintaining uniform temperature, thereby enhancing the precision and accuracy of the laser system.
Implementation Method 1
heat transfer fluid flow circuit extended through the body and surrounding the portion of the laser system
Implementation Method 2
substantially uniform or even heat transfer and reduced thermal gradient
Implementation Method 3
turbulator structures to ensure uniform heat transfer and reduce thermal gradients
Data Source
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AI summary
A thermal control apparatus (100) including a body (110) defining a centerline axis (112) extended along a height and a circumferential direction extended relative to the centerline axis (112). The body (110) forms a flow circuit (126) therethrough, an inlet opening (111), and an outlet opening (112) each in fluid (95) communication with the flow circuit (126). The flow circuit (126) is extended in parallel flow arrangement along the circumferential direction from the inlet opening (111) to the outlet opening (112). A cavity (114) is extended at least partially through the body (110) along the centerline axis (112). A thermal control system (1000) includes the thermal control apparatus (100), a fluid flow device (400) configured to provide a flow of heat transfer fluid (95) to the apparatus (100) through the inlet opening (111) and to receive the flow of heat transfer fluid (95) from the outlet opening (112) of the apparatus (100), and a flow conduit (97) providing fluid (95) communication of the flow of heat transfer fluid (95) between the fluid flow device (400) and the apparatus (100).