Laser Thickness Reduction in Solid Bodies Without Material Loss
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Solution Overview
Problem
Current methods for reducing the thickness of solid bodies in semiconductor processing, such as polishing or sawing, result in material loss and tool wear, leading to high costs and inefficiencies.
Innovation Solution
A method and apparatus that expose a solid body to light waves of different wavelengths to determine thickness and transmittance variations, allowing for precise introduction of laser radiation to produce modifications within the solid body, enabling controlled thickness reduction without material loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If polishing or lapping is used to reduce thickness, then thickness reduction is achieved, but material is lost and tool wear occurs
Solution Approach 1:
The patent replaces mechanical polishing/lapping systems with an optical measurement and laser processing system. Light waves are used to measure thickness and transmittance, and laser radiation is used to produce modifications, eliminating the need for mechanical contact and associated material loss and tool wear.
Solution Approach 2:
The patent changes the physical state and parameters of the solid body through controlled laser radiation rather than mechanical removal. By adjusting laser parameters (intensity, duration, wavelength) based on measured thickness and transmittance, precise modifications are achieved without the material loss inherent in mechanical processes.
2Manufacturing precision
If sawing is used to separate solid body layers, then separation is achieved, but material portions are lost and saw wear is high
Solution Approach 1:
The patent replaces mechanical sawing with an optical-based system. Light waves measure the solid body properties, and laser radiation creates modifications for separation, eliminating mechanical contact that causes material loss and saw blade wear.
Solution Approach 2:
The patent introduces light waves as an intermediary for measurement and laser radiation as an intermediary for modification. These optical intermediaries enable precise separation without direct mechanical contact, avoiding the material loss and tool wear associated with sawing.
3Loss of substance
If light waves and laser radiation are used for thickness reduction, then material loss is minimized and tool wear is reduced, but measurement precision is required
Solution Approach 1:
The patent employs feedback by using light wave measurements of thickness and transmittance to control laser radiation parameters. The measured values provide real-time information that feeds back to adjust the laser processing, ensuring precise modifications with minimal material loss.
Solution Approach 2:
The patent replaces mechanical measurement and processing systems with optical systems. Light waves provide non-contact measurement of thickness and transmittance, while laser radiation provides non-contact modification, eliminating the need for physical contact that causes wear and material loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise thickness reduction with minimal material loss and reduced tool wear, improving efficiency and cost-effectiveness in semiconductor processing.
Implementation Method 1
the light waves are partly reflected at the first surface and are partly coupled into the solid body and reflected at the second surface
Implementation Method 2
determining a second thickness and/or a second transmittance of the solid body in the volume portion
Implementation Method 3
introducing laser radiation into the volume portion of the solid body via the first surface to produce at least one modification in the interior of the solid body
Implementation Method 4
at least one laser parameter of the laser radiation is set at least depending on the second thickness and/or the second transmittance
Data Source
AI summary
A method and apparatus are provided. In an example, a volume portion of the solid body is exposed to light waves of different wavelengths, wherein the light waves are partly reflected at surfaces of the solid body. Light parameters of the reflected light waves are at least partly acquired using a sensor device. Distance information and/or intensity information are/is ascertained from at least a portion of the acquired light parameters. A thickness and/or a transmittance of the solid body in the volume portion are/is determined based upon the distance information and/or the intensity information. Laser radiation is introduced into the volume portion to produce a modification in the interior of the solid body, wherein at least one laser parameter of the laser radiation is set at least depending on the thickness and/or the transmittance such that the modification is at a predefined distance from a surface of the solid body.