Laser Transfer of Bare Dies into Substrate Recesses
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Solution Overview
Problem
Current techniques for miniaturizing electronic circuits are limited by the bulkiness of packaged semiconductor devices, which restricts the level of miniaturization and makes it difficult to embed active components within circuit boards due to the fragility of bare semiconductor dies and the inefficiency of pick-and-place tools for handling small or thin devices.
Innovation Solution
A laser-based transfer and embedding method that uses a laser-transparent support with a polymer material that volatilizes upon exposure to laser energy, allowing unpackaged semiconductor components to be transferred and embedded inside a substrate with direct-write interconnects, enabling the creation of embedded microelectronic circuits without damaging the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If packaged semiconductor devices are used, then the components are protected and easy to handle, but the size and weight of the circuit increase
Solution Approach 1:
The patent extracts the protective packaging from the semiconductor device, transferring only the bare die directly onto the circuit board. This eliminates the additional weight and volume of packaging materials while maintaining device functionality through direct mounting and encapsulation methods
Solution Approach 2:
The patent embeds the bare semiconductor die directly within recesses or cavities in the circuit board substrate, nesting the component inside the board structure rather than mounting it on the surface. This reduces overall circuit height and weight while protecting the die through the board material itself
2Ease of manufacture
If pick-and-place tools are used to mount bare dies, then components can be placed on the board, but small or thin devices are damaged due to their fragility
Solution Approach 1:
The patent replaces mechanical pick-and-place handling with direct transfer methods where bare dies are mounted onto the circuit board without mechanical gripping or manipulation. This substitution eliminates the mechanical stresses that cause damage to fragile devices during traditional placement processes
Solution Approach 2:
The patent introduces an intermediary transfer medium or method that allows bare dies to be moved and positioned without direct mechanical contact from pick-and-place tools. This intermediary system protects the fragile devices during transfer while enabling precise placement on the circuit board
3Ease of operation
If components are mounted on the surface of the circuit board, then placement is straightforward, but the circuit size and volume increase
Solution Approach 1:
The patent transitions from two-dimensional surface mounting to three-dimensional embedding by placing components within recesses and cavities in the circuit board substrate. This dimensional change allows components to be integrated within the board volume rather than occupying surface area, reducing overall circuit footprint and volume
4Volume of stationary object
If traditional embedding techniques are used for passive components, then miniaturization is partially achieved, but active components cannot be embedded
Solution Approach 1:
The patent develops a universal embedding methodology that can accommodate both passive and active semiconductor components using the same basic process steps. This multi-functional approach allows diverse component types to be embedded within the circuit board using consistent techniques, greatly expanding design flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the size and weight of electronic circuits, enhances electrical performance by shortening interconnects and reducing parasitic inductance, and allows for the rapid prototyping of adaptive electronics designs by embedding components within the substrate, overcoming the limitations of traditional pick-and-place techniques.
Implementation Method 1
the polymer material has the property of being or becoming more volatile than the transfer component when exposed to laser energy
Implementation Method 2
exposing the carrier substrate to laser energy from the laser so that the laser energy is directed through the back surface of the carrier substrate and through the laser-transparent support to strike the polymer material
Data Source
AI summary
A laser direct write method used to transfer entire single components such as semiconductor bare dies or surface mount passive and active components on a substrate or inside recess in a substrate for making embedded microelectronics is disclosed. This method laser-machine the pockets, laser-transfer the individual components inside those pockets, and then laser-print the interconnects required to “wire” the components, thus resulting in a fully assembled embedded circuit required to make a fully functional microelectronic system.