Laser Transfer Substrate Blister Segmentation for Reliable Element Release
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Solution Overview
Problem
Existing element transfer devices face challenges in reliably separating elements from transfer substrates due to excessive adhesive force, where the contact surface area between the blister and the element remains large, preventing effective transfer to receiving substrates.
Innovation Solution
A transfer device comprising a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit that irradiates the ablation layer of the transfer substrate at multiple locations within the holding region, reducing the contact surface area and facilitating reliable separation by controlling the irradiation pattern and power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single blister is produced by laser irradiation of the holding region, then the element is pushed out by blistering, but the contact surface area between the blister and element remains large causing excessive adhesive force that prevents separation
Solution Approach 1:
The patent divides the single large blister into multiple smaller blisters by irradiating multiple discrete locations within the holding region. This segmentation reduces the total contact surface area between the blister and element, thereby reducing adhesive force and enabling reliable separation. The ablation layer is heated at multiple separate points rather than one large area, creating multiple small blistering zones that collectively push the element off with sufficient force.
2Reliability
If the ablation layer is irradiated at multiple locations, then the contact surface area is reduced and separation is facilitated, but the device complexity and irradiation control difficulty increase
Solution Approach 1:
The patent employs periodic pulsed laser irradiation at multiple locations within the holding region. By using sequential or simultaneous pulses at predetermined positions, the system creates multiple small blisters through repeated periodic heating cycles. This periodic action pattern simplifies control compared to continuous irradiation while achieving the desired segmentation effect for reliable element separation.
3Reliability
If multiple locations are irradiated to reduce contact surface area, then element separation is improved, but the energy consumption and processing time increase
Solution Approach 1:
The patent applies local quality by concentrating laser energy at multiple specific discrete locations within the holding region rather than uniformly irradiating the entire area. Each irradiation point receives sufficient energy to create a small blister, but the total energy consumed is less than what would be required to create one large blister covering the entire holding region. This localized approach reduces overall energy consumption while achieving effective element separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable separation and transfer of elements from the transfer substrate to the receiving substrate, reducing the risk of elements remaining adhered and ensuring stable and precise transfer, while also minimizing the output and cost of the laser energy required.
Implementation Method 1
The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation
Implementation Method 2
when blistering is produced by ablation in the part of the transfer substrate that holds the element
Data Source
AI summary
A transfer device is provided that comprises a transfer substrate holding unit, a receiving substrate holding unit, and an active energy ray irradiation unit. The transfer substrate holding unit holds a transfer substrate with an ablation layer on which at least one element is held. The receiving substrate holding unit holds a receiving substrate such that the ablation layer of the transfer substrate is opposite the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer of the transfer substrate with an active energy ray to cause ablation for transferring the at least one element held by the ablation layer from the transfer substrate to the receiving substrate. The active energy ray irradiation unit irradiates the ablation layer with the active energy ray at a plurality of locations in a holding region of the ablation layer that holds one of the at least one element.