Laser Transfer Buffer Layer for OLED Element Alignment
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Solution Overview
Problem
Existing methods for transferring light-emitting elements in OLED display devices, such as laser lift off (LLO), suffer from damage and misalignment issues during the laser irradiation process.
Innovation Solution
The use of an elastic member with specific mechanical properties (storage modulus of 0.01 Pa or more, loss modulus of 10.0 Pa or more, and viscosity of 1.8 Pa·s or more) to support the light-emitting elements during laser transfer, absorbing kinetic energy and preventing misalignment and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser beam irradiation is used to transfer light-emitting elements, then transfer speed and productivity are improved, but damage to light-emitting elements and misalignment occur
Solution Approach 1:
A buffer layer is introduced as an intermediary between the light-emitting element and the substrate. This buffer layer absorbs the kinetic energy from laser-induced detachment, preventing direct impact damage to the light-emitting element while maintaining efficient transfer. The buffer layer acts as a energy dissipation medium that mediates the interaction between the laser field and the light-emitting element.
Solution Approach 2:
The buffer layer is pre-positioned on the substrate before laser transfer occurs. It provides beforehand cushioning by being in place to absorb impact energy when the light-emitting element is detached by laser irradiation. This prior preparation ensures that the protective function is already established, preventing damage before it can occur.
2Manufacturing precision
If high density mounting of light-emitting elements is implemented, then image resolution is improved, but misalignment during laser transfer increases
Solution Approach 1:
The buffer layer serves as a mediator that stabilizes the transfer process, reducing misalignment even when light-emitting elements are densely packed. By absorbing kinetic energy and providing a compliant interface, it ensures that elements transfer to their intended positions without deviation, maintaining positioning accuracy despite high density mounting requirements.
Solution Approach 2:
The buffer layer changes the mechanical parameters of the transfer interface, providing elasticity and energy absorption capability. This parameter change allows for precise positioning by dampening vibrations and shocks that would otherwise cause misalignment during laser transfer of densely packed elements.
3Productivity
If laser irradiation power is increased to improve transfer efficiency, then productivity increases, but damage to light-emitting elements worsens
Solution Approach 1:
The buffer layer acts as a protective intermediary that absorbs excess kinetic energy from high-power laser irradiation. This allows the use of higher laser powers for improved transfer efficiency while the buffer layer prevents the harmful effects of excessive energy transfer to the light-emitting element, effectively decoupling laser power from damage risk.
Solution Approach 2:
The buffer layer converts the potentially harmful kinetic energy from laser irradiation into a beneficial energy absorption mechanism. By designedly placing a material in the path of energy transfer that absorbs and dissipates this energy, the harmful laser-induced shock is transformed into a controlled energy dissipation process that protects the light-emitting element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces misalignment and damage of light-emitting elements, enhancing the manufacturing process efficiency and reliability of OLED display devices.
Implementation Method 1
transferred the first light emitting element from the first substrate onto the second substrate by irradiating a laser beam
Implementation Method 2
the first elastic member has a storage modulus of 0.01 Pa or more, a loss modulus of 10.0 Pa or more, and a viscosity of 1.8 Pa·s or more
Implementation Method 3
the first elastic member has a storage modulus of 0.01 Pa or more, a loss modulus of 10.0 Pa or more, and a viscosity of 1.8 Pa·s or more
Data Source
AI summary
A method of fabricating a display device, can include providing a first light emitting element on a first substrate; providing a first elastic member on a second substrate; disposing the first substrate including the first light emitting element over the second substrate including the first elastic member; and transferring the first light emitting element from the first substrate onto the second substrate by irradiating a laser beam, wherein the first elastic member has a storage modulus of 0.01 Pa or more, a loss modulus of 10.0 Pa or more, and a viscosity of 1.8 Pa·sor more. Accordingly, it is possible to provide a process for manufacturing a display device, where misalignment and damage (e.g., breakage) of light emitting elements are suppressed.