Laser Transfer Structure With Photoresist Supports for Micro-LED Alignment
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Solution Overview
Problem
Micro-LED transfer technologies face issues with chip rollover or rotation during laser transfer, leading to reduced transfer yield.
Innovation Solution
A laser transfer structure incorporating a carrier with a release layer and surrounding photoresist structures to stabilize the chip during transfer, using laser radiation to move chips between carriers, enhancing stability and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser transfer is used to transfer micro-LED chips, then transfer speed and efficiency are improved, but chip rollover or rotation occurs during transfer, reducing transfer yield
Solution Approach 1:
The patent introduces photoresist structures as intermediary elements surrounding the chip on the carrier. These photoresist structures act as a mediator between the laser transfer process and the chip, providing lateral support and constraint during the transfer operation. This intermediary structure prevents direct laser-induced rollover while maintaining transfer efficiency.
Solution Approach 2:
The photoresist structures are pre-formed around the chip before the laser transfer process begins. This preliminary anti-action creates a protective framework that counteracts the potential rollover and rotation forces during laser transfer, preventing the harmful effects before they can occur.
2Speed
If laser radiation is applied to transfer the chip, then transfer speed is improved, but lateral kinetic energy causes chip rotation and misalignment
Solution Approach 1:
The photoresist structures serve as intermediary constraint elements that limit lateral kinetic energy during high-speed transfer. By surrounding the chip, these structures mediate between the fast laser transfer process and the chip's lateral stability, maintaining alignment precision despite increased transfer speed.
Solution Approach 2:
The photoresist structures provide beforehand cushioning by being pre-positioned around the chip. This cushioning effect absorbs and distributes lateral kinetic energy during the laser transfer process, preventing rotation and maintaining chip alignment with the target substrate.
3Device complexity
If no supporting structure is used during laser transfer, then the process is simple, but the chip is prone to rollover and rotation
Solution Approach 1:
The photoresist structures are introduced as minimal intermediary elements that provide necessary lateral support. While they add some complexity to the carrier structure, they significantly improve chip stability during transfer by preventing rollover and rotation, representing an acceptable trade-off.
Solution Approach 2:
The supporting structure is segmented into multiple photoresist structures arranged around the chip perimeter. This segmentation provides distributed lateral support at multiple points, effectively preventing rotation and rollover while keeping each individual photoresist structure simple and the overall process relatively straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The photoresist structures suppress lateral kinetic energy, improving the transfer yield by maintaining chip alignment and reducing the chip rotation, thus enhancing the chip's transfer precision and reducing the chip-fall rate, thereby improving the yield of the transfer process.
Implementation Method 1
transferring the chip from the first carrier to the second carrier using laser radiation
Implementation Method 2
transferring the first chip from the first carrier to the second carrier using first laser radiation
Data Source
AI summary
A laser transfer structure and a method for forming the same are provided. The laser transfer structure includes a carrier, a release layer disposed on the carrier, a first chip disposed on the release layer, and a plurality of first photoresist structures disposed on the carrier and surrounding the first chip. A method for fabricating a display module is also provided.