Laser Transmitter Packaging With Transparent Thermal Optical Coupling
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Solution Overview
Problem
Traditional butterfly packaged semiconductor laser devices face performance degradation due to poor heat dissipation, especially in high power consumption and extreme temperature environments, which affects their light-emitting performance.
Innovation Solution
A high-performance light transmitter design featuring a semiconductor refrigeration assembly with independent refrigeration portions, a light emitting assembly, and a transparent filling glue to guide the laser beam and transfer heat, along with a heat sink for enhanced heat dissipation and temperature control, utilizing thermistors for temperature monitoring and control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional butterfly packaging is used for semiconductor laser devices, then the device structure is simple and easy to manufacture, but the heat dissipation performance is poor leading to temperature increase affecting light-emitting performance
Solution Approach 1:
The packaging structure is divided into separate functional modules: a heat dissipation module with independent heat dissipation chamber, an optical module housing, and a mounting module. This segmentation allows optimized heat dissipation pathways while maintaining manufacturing simplicity through modular assembly.
Solution Approach 2:
A transparent filling glue is introduced as an intermediary substance between the laser device and the housing structure. This glue serves dual functions: optically it guides the laser beam through the housing, and thermally it transfers heat from the laser device to the heat dissipation structures, resolving the contradiction between optical performance and heat dissipation.
2Productivity
If the light transmitter operates in high power consumption scenarios, then the bandwidth and information exchange capacity increase, but the temperature increase affects light-emitting performance due to poor heat dissipation
Solution Approach 1:
The heat dissipation design implements local quality optimization by providing dedicated heat dissipation structures positioned adjacent to high-power components. The heat dissipation chamber and thermal pathways are strategically located to maximize heat removal from the laser device and detector, enabling high power operation with stable temperature control.
Solution Approach 2:
The transparent filling glue performs multiple functions simultaneously: it acts as an optical waveguide for the laser beam, a thermal conductor for heat transfer, and a structural adhesive bonding components. This multi-functionality enables high power operation without compromising optical performance or temperature stability.
3Adaptability or versatility
If the light transmitter is designed for extreme temperature environments, then the adaptability to special scenarios improves, but the heat dissipation performance must be significantly enhanced
Solution Approach 1:
The optical guiding function and heat dissipation function are merged into a single integrated structure. The transparent filling glue simultaneously guides laser light and conducts heat, eliminating the need for separate optical pathways and thermal management structures. This merging enables extreme temperature environment adaptability while keeping the device complexity manageable.
Solution Approach 2:
The patent employs composite material strategies by using transparent filling glue with optimized optical and thermal properties. This composite approach combines the light-guiding capabilities of transparent materials with the heat-conducting properties of thermally conductive compounds, enabling the device to operate reliably in extreme temperature environments without excessive structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation efficiency and temperature stability, allowing the light transmitter to operate effectively over a wider temperature range (−45°C to 85°C) with reduced power consumption and enhanced optical coupling efficiency.
Implementation Method 1
a semiconductor refrigeration assembly arranged on the substrate; a light emitting assembly mounted on the semiconductor refrigeration assembly, so that the semiconductor refrigeration assembly cools the light emitting assembly
Implementation Method 2
a transparent filling glue filled in a space between an inner wall of the tube shell and the substrate, and configured to guide the laser beam generated by the light emitting assembly to the optical fiber and transfer a heat generated by the light emitting assembly to the tube shell
Implementation Method 3
an optical fiber configured to output the laser beam generated by the light emitting assembly to an outside of the tube shell
Data Source
AI summary
Provided is a light transmitter, including: a substrate; a semiconductor refrigeration assembly arranged on the substrate; a light emitting assembly mounted on the semiconductor refrigeration assembly, so that the semiconductor refrigeration assembly cools the light emitting assembly, and the light emitting assembly is configured to generate a laser beam; a tube shell mounted on the substrate to package the semiconductor refrigeration assembly and the light emitting assembly; an optical fiber configured to output the laser beam generated by the light emitting assembly to an outside of the tube shell; and a transparent filling glue filled in a space between an inner wall of the tube shell and the substrate, and configured to guide the laser beam generated by the light emitting assembly to the optical fiber and transfer a heat generated by the light emitting assembly to the tube shell.