Compact Laser Triangulation Sensor for Small Diameter Holes
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Solution Overview
Problem
Current laser 2D scanners are unable to scan holes with diameters of 68 mm due to their large dimensions and lack high-speed direct data transmission capabilities, which is insufficient for precise measurement of surface geometry and quality control of country oil tubular goods, requiring a measurement error of ±0.005 mm and data transmission at 100 Hz.
Innovation Solution
A cylindrical laser triangulation sensor with a specialized housing and optical setup, featuring a CMOS matrix and power supply unit, allowing for precise manipulation and reduced measurement error, enabling scanning of 65 mm diameter holes at a distance of at least 132 mm from the end face with high-speed data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional laser 2D scanners are used, then measurement precision can be maintained, but the device cannot physically access holes with diameter of 68 mm due to large dimensions
Solution Approach 1:
The sensor housing is divided into two separate coaxial cylindrical parts: an outer cylinder (60 mm diameter) containing the optical system and an inner cylinder (50 mm diameter) containing the power supply and computation unit. This segmentation allows the optical components to be positioned optimally for measurement precision while reducing the overall envelope dimensions to fit within 68 mm holes.
Solution Approach 2:
The inner cylindrical housing is nested within the outer cylindrical housing, with both cylinders aligned coaxially. The inner cylinder houses the power supply and computation unit, while the outer cylinder contains the optical setup. This nested arrangement maximizes space utilization and reduces the overall sensor footprint to enable access to small diameter holes while maintaining measurement precision.
2Productivity
If conventional laser 2D scanners are used, then device complexity is reduced, but data transmission speed from CMOS sensor array to PC is insufficient for adaptive scanning algorithms
Solution Approach 1:
The power supply unit and computation unit are merged into a single integrated housing, with the computation unit positioned inside the same cylindrical structure as the optical system. This integration allows for high-speed data transmission (up to 100 Hz) from the CMOS sensor array to the computation unit within the sensor, enabling adaptive scanning algorithms while maintaining a compact form factor.
Solution Approach 2:
The computation unit acts as an intermediary between the CMOS sensor array and the external PC, processing data at high speeds (100 Hz) before transmission. This intermediary computation unit enables adaptive scanning algorithms to be implemented locally within the sensor, significantly increasing productivity while the integrated housing keeps the overall device complexity manageable.
3Volume of moving object
If sensor components are arranged for compact housing, then access to small holes is enabled, but measurement precision may be compromised
Solution Approach 1:
The outer cylindrical housing is designed with a diameter of 60 mm specifically optimized for the optical system requirements, while the inner cylindrical housing has a diameter of 50 mm optimized for electronic components. This local quality differentiation ensures that the optical components have sufficient space for precise alignment and operation, maintaining measurement precision of ±0.005 mm while the overall compact dimensions enable access to small diameter holes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise measurement of small-diameter holes with a reduced error of ±0.005 mm and high-speed data transmission, allowing for efficient scanning and data processing, overcoming the limitations of existing scanners by optimizing the sensor's design and arrangement of components.
Implementation Method 1
laser emitter, which projects a laser beam onto an object
Implementation Method 2
a two-dimensional CMOS matrix with lens collects light scattered at the object
Data Source
AI summary
A two-dimensional laser triangulation sensor for measuring small diameter holes. The housing of the sensor is cylindrical and consists of two coaxial cylindrical parts, joined by their ends. The cylindrical parts of the housing have different diameters, and an optical circuit of the sensor is disposed in the cavity of the larger diameter cylindrical part of the sensor housing, said optical circuit consisting of a laser emitter, an electronic printed circuit board with a built-in CMOS array, and a focusing lens, which is mounted at an angle to the electronic printed circuit board. The larger diameter cylindrical part of the housing is provided with an aperture, in which a protective glass is mounted. A power supply and computation unit is disposed in the cavity of the smaller diameter cylindrical part of the housing. The power supply and computation unit consists of an electronic printed circuit board having arranged thereon a connector for connecting a CMOS array connector to a processor for processing data from the CMOS array, a power control microcircuit, a power connector, and a connector for data transfer to an electronic computer. An opening is provided in the joined ends of both parts of the housing, said opening connecting the cavities of the two parts of the housing and having wires laid therein for supplying power and for controlling the operating modes of the laser and the array, as well as for transferring data from the array to the computation unit. The sensor additionally contains a cylindrical bracket, which is coaxially joined to the second end of the smaller diameter cylindrical part of the housing and has disposed therein wires for supplying power to the power and computation unit and wires for communication with the electronic computer.