Full-Field Laser Ultrasonic Imaging for Through-Thickness Defect Detection
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Solution Overview
Problem
Conventional ultrasonic testing techniques, including C-scan and air-coupled methods, face limitations in detecting through-the-thickness defects due to the use of contact transducers and single-point ultrasound sources, which restrict inspection distance and accuracy in detecting in-plane and through-the-thickness damage.
Innovation Solution
A full-field pulse-echo laser ultrasonic propagation imaging system that generates and senses ultrasounds non-contactually using laser beams, allowing simultaneous scanning and visualization of through-the-thickness defects across a broad area through 3D imaging techniques, enhancing defect detection accuracy and sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional ultrasonic testing techniques use contact transducers and single-point ultrasound sources, then the inspection can be performed with simple equipment, but the inspection distance is limited and the detection of through-the-thickness defects is inaccurate
Solution Approach 1:
The patent replaces contact mechanical transducers with non-contact laser ultrasonic generation and detection systems. The laser beam generates ultrasound in the structure without physical contact, and the reflected laser beam detects the ultrasound propagation, eliminating the need for couplants and contact transducers while improving inspection distance and through-the-thickness defect detection accuracy.
Solution Approach 2:
The patent transitions from single-point ultrasound source to full-field ultrasound generation by scanning the laser beam across the surface. This dimensional expansion from point to area enables simultaneous multi-point excitation and detection, providing comprehensive coverage for detecting both in-plane and through-the-thickness defects with improved accuracy.
2Productivity
If conventional ultrasonic testing uses contact transducers, then the equipment is simpler to operate, but much time is required for inspection
Solution Approach 1:
The patent implements continuous scanning of the laser beam across the structure surface, enabling simultaneous ultrasound generation and detection at multiple points. This continuous full-field inspection method eliminates the sequential point-by-point measurement process of conventional techniques, dramatically reducing inspection time while maintaining high productivity.
3Measurement precision
If single-point ultrasound source is used, then the equipment configuration is simpler, but in-plane and through-the-thickness damage cannot be exactly detected
Solution Approach 1:
The patent expands the ultrasound source from a single point to a full field by scanning the laser beam across the surface. This enables simultaneous excitation and detection at multiple locations, providing precise spatial information for locating both in-plane and through-the-thickness defects with high accuracy through full-field visualization.
Solution Approach 2:
The patent creates a multi-functional system where the same laser scanning mechanism serves both as the ultrasound generation source and the detection probe. This universal approach enables simultaneous measurement of multiple defect types (in-plane and through-the-thickness) and provides comprehensive structural assessment without requiring separate specialized equipment for each defect type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-accuracy visualization of through-the-thickness defects with increased signal-to-noise ratio through repeated scanning, effectively detecting defects in thick structures even when accessed from one side, and providing precise location of damage.
Implementation Method 1
a method which generates ultrasounds of a wideband on a surface of a structure through a laser ultrasonic generator of a thermoeleastic mechanism
Implementation Method 2
the receiver may be configured to receive the laser ultrasounds in the noncontact method
Implementation Method 3
The receiver may be configured to sense the ultrasounds propagated to a continuous wave laser interferometer
Data Source
AI summary
A system and method for full-field pulse-echo laser ultrasonic propagation imaging is provided. The full-field ultrasonic propagation imaging system generates ultrasounds on a structure by scanning the structure and emitting laser beams, simultaneously senses ultrasounds propagated through thickness of the structure, and generates a through-the-thickness ultrasonic propagation image. Accordingly, the full-field pulse-echo laser ultrasonic propagation imaging can visualize information on through-the-thickness defects in a full field.