Laser Vacuum Nozzle for Fast PCB Component Repositioning
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Solution Overview
Problem
Existing methods for removing or repositioning electronic components on a circuit board, such as μLEDs, are inefficient due to the need for complex tool positioning in multiple dimensions, reducing processing speed.
Innovation Solution
A device comprising a vacuum suction nozzle with a laser beam emitter and an infrared temperature sensor that selectively heats and removes or repositions components using vacuum suction, allowing for positioning only in the x-y plane, thereby increasing processing speed and using simple tool designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser beam emitter and gripping tool are positioned in x-y-z space with separate positioning systems, then the heating and gripping functions can be performed, but the processing speed is reduced due to complex multi-dimensional positioning
Solution Approach 1:
The patent combines the laser beam emitter and the vacuum suction gripping tool into a single integrated tool head that operates in the x-y plane. The laser emitter is positioned at a predetermined location relative to the suction opening, allowing both heating and gripping functions to be performed by a single positioning system without requiring separate x-y-z positioning for multiple tools, thereby increasing processing speed and reducing system complexity
Solution Approach 2:
The integrated tool head serves multiple functions: the laser beam emitter performs heating to detach the electronic component, while the vacuum suction nozzle performs both gripping and positioning. This multi-functional design eliminates the need for separate specialized tools for each operation, simplifying the overall system while maintaining full functionality
2Productivity
If contact heating or hot nitrogen is used to heat the defective LED, then the heating function is achieved, but the processing speed is reduced and tool design becomes complex
Solution Approach 1:
The patent replaces mechanical contact heating methods (such as contact heating tools or hot nitrogen delivery systems) with a laser beam emitter that provides contactless heating. This substitution eliminates the need for complex mechanical heating tool design while achieving faster, more precise heating of the defective electronic component, thereby improving both processing speed and tool design simplicity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables faster and more efficient removal and repositioning of electronic components by using a laser beam to heat and detach components from the circuit board, combined with vacuum suction, eliminating the need for z-axis movement and simplifying tool design, thus enhancing processing speed.
Implementation Method 1
A laser beam is directed through the exchangeable adaptor tip and onto the electronic component. The electronic component is heated using the laser beam so as to melt the solder and detach the electronic component.
Implementation Method 2
The electronic component is heated using the laser beam so as to melt the solder and detach the electronic component.
Implementation Method 3
The temperature around the contact area is measured based on infrared radiation emitted from around the contact area.
Implementation Method 4
The electronic component is then sucked through the exchangeable adaptor tip and into the vacuum suction nozzle using vacuum suction.
Data Source
AI summary
A device for removing or repositioning defective and erroneously placed electronic components from circuit boards includes a vacuum suction nozzle, a laser beam and a temperature sensor. The vacuum nozzle has an adaptor tip at which suction is generated. The adaptor tip is larger than the defective or erroneously positioned electronic component. The laser beam is emitted out of the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing or repositioning the defective or erroneously placed electronic component from the circuit board positions the adaptor tip over the electronic component and directs the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then removed or repositioned and remounted on the circuit board.