Molded Laser Via Interposer for Compact IC Packaging
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in achieving reduced size without compromising performance, while also simplifying manufacturing, improving reliability, and reducing costs and electrical components on circuit boards.
Innovation Solution
The method involves providing a substrate with an integrated circuit, mounting an interposer substrate with an interposer pad, covering it with an encapsulant, and forming holes in the encapsulant to align with the interposer pad, allowing conductive connectors to be placed in direct contact, which reduces the interposer pitch and package size, and enhances warpage control and interconnect joint protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packaging technology is used, then manufacturing is easier and more established, but package size is larger and functionality is reduced
Solution Approach 1:
The patent implements a package-on-package structure where a first package containing an integrated circuit is positioned on top of a second package containing another integrated circuit. This nesting approach allows multiple functional units to be stacked vertically, reducing the overall footprint area while maintaining individual package integrity and manufacturability
Solution Approach 2:
The invention transitions from a planar side-by-side package arrangement to a three-dimensional stacked configuration. By utilizing the vertical dimension (Z-axis) rather than only the horizontal plane, the package density increases and footprint area decreases, achieving size reduction without compromising manufacturing processes
2Area of stationary object
If package size is reduced, then footprint area decreases, but warpage control becomes more difficult
Solution Approach 1:
The patent introduces a support structure specifically positioned beneath the first package to provide localized mechanical support. This support structure has a footprint area smaller than the first package, creating a distributed support system that maintains planarity and controls warpage in critical areas without requiring full-coverage support, thus managing stress distribution in the compact stacked configuration
3Quantity of substance
If interposer pitch is reduced, then package density increases, but manufacturing precision requirements increase
Solution Approach 1:
The invention divides the interposer substrate into multiple discrete regions or zones, each containing specific interconnect structures. This segmentation allows for modular manufacturing where each segment can be processed and positioned independently, reducing the cumulative precision requirements compared to processing the entire interposer as a single unit, thereby enabling higher package density with manageable precision levels
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a more stable and effective conductive connector mount, allowing for a smaller package profile, reduced electrical shortages, and improved warpage control, while maintaining performance and functionality.
Implementation Method 1
covering an encapsulant over the integrated circuit and the interposer substrate
Implementation Method 2
forming a hole through the encapsulant aligned over the interposer pad
Implementation Method 3
placing a conductive connector on and in direct contact with the interposer pad
Data Source
AI summary
A method of manufacture of an integrated packaging system includes: providing a substrate; mounting an integrated circuit on the substrate; mounting an interposer substrate having an interposer pad on the integrated circuit; covering an encapsulant over the integrated circuit and the interposer substrate; forming a hole through the encapsulant aligned over the interposer pad; and placing a conductive connector on and in direct contact with the interposer pad.