Laser Processing Apparatus Visual Wafer Alignment
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Solution Overview
Problem
The complexity of setting processing conditions for laser processing apparatuses when dealing with multi-project type wafers, where devices of different shapes and sizes are mixed, increases the likelihood of incorrect working conditions being set, especially when the scheduled division line is interrupted.
Innovation Solution
A laser processing apparatus with a chuck table, laser beam irradiation means, moving means, display means, inputting means, and storage means that allows for visual setting of coordinates for the start and end points of a scheduled division line by displaying a mark portion overlapping with the picked-up image, enabling the storage of desired positions for forming a modification layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If processing conditions are manually set for multi-project type wafers with interrupted division lines, then the laser processing apparatus can handle complex wafer configurations, but the complexity of setting processing conditions increases and the likelihood of incorrect settings rises
Solution Approach 1:
The patent uses image pickup means to capture an image of the wafer and displays it on a display unit. The operator can visually identify and set coordinates for division lines by overlaying a mark on the displayed image, creating a visual copy of the wafer layout that simplifies condition setting without manual calculation or complex programming.
Solution Approach 2:
The patent introduces a mark as an intermediary element that overlays on the displayed wafer image. This mark serves as a mediator between the operator's intent and the coordinate input system, allowing intuitive visual positioning rather than direct coordinate entry, thereby reducing setting complexity and errors.
2Manufacturing precision
If complex processing conditions are set for interrupted division lines, then accurate laser irradiation can be achieved on multi-project wafers, but the ease of operation deteriorates due to difficult condition setting
Solution Approach 1:
The system creates a visual copy of the wafer through image pickup and display, allowing operators to set precise coordinates by visually referencing the displayed image rather than relying on external documentation or complex calculations. This visual copying mechanism maintains precision while dramatically improving ease of operation.
Solution Approach 2:
The patent replaces manual coordinate calculation and entry mechanisms with an automated image pickup and display system. The coordinate information is automatically obtained through image processing and mark positioning, substituting mechanical/manual operations with automated optical and computational systems that are both precise and easy to use.
3Ease of operation
If visual setting methods are implemented using mark overlay on picked-up images, then information setting becomes easier and more accurate, but the device complexity increases due to additional components
Solution Approach 1:
The patent integrates multiple functions into existing components: the display unit serves both for showing wafer information and for visual coordinate setting; the image pickup means serves both for wafer inspection and for providing the visual basis for coordinate setting; the mark serves both as a visual aid and as a coordinate input mechanism. This multi-functionality reduces the need for separate dedicated components.
Solution Approach 2:
The system uses the wafer's own image, captured by the image pickup means, as the basis for setting processing conditions. The displayed image itself serves as the reference for coordinate setting, eliminating the need for separate reference documents or external measurement tools. The system essentially sets its own conditions using its own captured image.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the easy and accurate setting of information necessary for wafer processing, reducing the risk of incorrect working conditions and facilitating the formation of modification layers along scheduled division lines in complex wafer configurations.
Implementation Method 1
a laser beam of a wavelength which passes through a wafer having a surface on which a plurality of devices are disposed is irradiated along a schedule division line to separate the adjacent devices from each other to form a modification layer
Data Source
AI summary
A laser processing apparatus is provided wherein a laser beam of a wavelength which passes through a wafer having a surface on which a plurality of devices are disposed is irradiated along a schedule division line to separate the adjacent devices from each other to form a modification layer which continuously extends in a given length in the inside of the wafer. A mark portion is displayed in an overlapping relationship with a picked up image obtained by image pickup of a wafer on a display unit. If the mark portion is moved to a desired position of the picked up image displayed on the display unit, then coordinates which correspond to the desired position of the picked up image are stored as a start point or an end portion of a scheduled division line, along which the modification layer is to be formed, into a storage unit.