Laser Wafer Dicing with Dynamic Focus Height Control
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Solution Overview
Problem
Existing wafer processing technologies face challenges in precisely cutting wafers without damaging semiconductor chips during the dicing process, while also seeking to improve production efficiency.
Innovation Solution
A wafer processing apparatus is designed with a light source unit, spatial laser modulators, a beam expander, a galvanometer, and a condensing lens, which work together to precisely control the beams for cutting the wafer with improved efficiency by adjusting the divergence angle based on position information.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing operation is performed to divide the wafer into semiconductor chips, then productivity is improved, but the risk of damaging semiconductor chips increases
Solution Approach 1:
The patent replaces mechanical dicing tools with a laser-based cutting system. The laser beam is focused to a precise condensing point on the wafer to cut between chips without mechanical contact, eliminating the risk of mechanical damage while maintaining high productivity through non-contact processing
Solution Approach 2:
The patent dynamically adjusts the divergence angle of the laser beam based on real-time position information of the wafer. By changing the beam parameters (divergence angle) according to positional deviations, the system maintains precise cutting accuracy and consistent condensing point height, ensuring reliable chip separation without damage
2Manufacturing precision
If the cutting precision is improved to avoid chip damage, then manufacturing precision is improved, but the complexity of the processing system increases
Solution Approach 1:
The patent incorporates a feedback mechanism where position information of the wafer is detected in real-time, and the divergence angle of the laser beam is adjusted accordingly. This closed-loop control system maintains precise cutting accuracy while automating the compensation process, reducing the need for complex manual adjustments
Solution Approach 2:
The patent uses a dynamic beam expander that can adjust the divergence angle of the laser beam in real-time based on wafer position feedback. This dynamic adjustment capability allows the system to maintain manufacturing precision under varying conditions without requiring overly complex static mechanisms
3Manufacturing precision
If the beam divergence angle is adjusted based on position information, then manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent designs the beam expander to serve multiple functions: it not only expands the laser beam but also dynamically adjusts the divergence angle based on position information. This multi-functionality reduces the need for separate adjustment mechanisms, managing device complexity while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves precise cutting of wafers and improves production efficiency by maintaining the height level of the condensing point consistently, reducing the likelihood of errors during the dicing process.
Implementation Method 1
a first spatial laser modulator configured to reflect the first beam
Implementation Method 2
a beam expander configured to adjust a divergence angle of the first beam
Implementation Method 3
a second spatial laser modulator configured to reflect the second beam
Implementation Method 4
a galvanometer configured to reflect the first beam or the second beam
Implementation Method 5
a condensing lens configured to refract the first beam or the second beam
Implementation Method 6
The condensing lens may be configured to condense the first beam to a condensing point
Data Source
AI summary
A wafer processing apparatus may include a light source unit emitting a first beam, a first spatial laser modulator reflecting the first beam, a beam expander adjusting a divergence angle of the first beam, a sensor unit emitting a second beam, a second spatial laser modulator reflecting the second beam, a galvanometer reflecting the first beam or the second beam, and a condensing lens refracting the first beam or the second beam. The sensor unit may receive position information generated while the second beam is moving in a first direction on a wafer. The first beam may be condensed to a condensing point by the condensing lens. Angle information for controlling a height level of the condensing point may be generated based on the position information. The beam expander may adjust the divergence angle of the first beam based on the angle information.