Semiconductor Laser Wafer Cleavage Using Pressing Marks
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Solution Overview
Problem
The existing method for manufacturing semiconductor laser devices often results in lateral cracks during secondary scribing, leading to brittle fracture, peeling, and chipping due to imprecise control of diamond tools during the process.
Innovation Solution
A method involving the formation of a pressing mark group on the wafer surface along first boundary lines using a gear-shaped wheel to suppress lateral cracks, allowing for precise cleavage and reducing the likelihood of large-scale brittle fractures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If diamond tool is used for secondary scribing to divide laser bars into semiconductor laser devices, then manufacturing precision can be improved, but lateral cracks may occur along the scribe line causing brittle fracture and peeling
Solution Approach 1:
The patent applies preliminary action by forming pressing marks at intended scribe locations before actual cleavage. These pressing marks are created by pressing a gear-shaped wheel against the wafer surface, creating localized stress concentration points that guide subsequent cleavage while preventing lateral crack propagation. The pressing marks serve as pre-prepared sites for controlled fracture, eliminating the need for direct diamond tool scribing that causes lateral cracks.
Solution Approach 2:
The patent replaces the mechanical scribing system (diamond tool) with a pressing mark formation system (gear-shaped wheel). Instead of using a diamond tool to physically carve the scribe line which generates lateral cracks, the invention uses a gear-shaped wheel to create pressing marks that guide cleavage through stress concentration. This substitution eliminates the harmful mechanical action of diamond scribing while achieving the same division function through controlled cleavage along the pressing mark lines.
2Reliability
If pressing mark group is formed using gear-shaped wheel to suppress lateral cracks, then reliability is improved, but device complexity increases
Solution Approach 1:
The gear-shaped wheel serves multiple functions: it creates pressing marks for crack suppression, defines scribe line positions, and guides the cleavage process. This single tool performs what would otherwise require multiple separate operations (marking, positioning, and controlled fracture), simplifying the overall process despite the added step of pressing mark formation. The gear teeth pattern naturally creates the necessary pressing marks along the scribe line.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses the occurrence of lateral cracks in semiconductor laser devices, improving yield and maintaining mechanical strength, thereby enhancing the manufacturing process efficiency and device reliability.
Implementation Method 1
forming a pressing mark group including a plurality of continuous pressing marks on a first primary surface of the wafer or a second primary surface opposite to the first primary surface
Data Source
AI summary
Provided is a method for manufacturing a semiconductor laser device that includes a semiconductor substrate, and a semiconductor stacked body including an active layer and formed on the semiconductor substrate. The method includes a first step of preparing a wafer including a plurality of device portions to each become the semiconductor laser device, the plurality of device portions being arranged in a first direction perpendicular to an optical waveguide direction of the semiconductor stacked body, and a second step of forming a pressing mark group including a plurality of continuous pressing marks on a first primary surface of the wafer or a second primary surface opposite to the first primary surface to be positioned on each of a plurality of first boundary lines that partition the plurality of device portions arranged in the first direction after the first step.