Laser Wafer Repair Using Server-Side Test Data Conversion
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Solution Overview
Problem
The existing wafer repair process using laser equipment is inefficient due to limited storage space and prone to errors, leading to reduced repair efficiency and effectiveness, especially when dealing with large test data sets.
Innovation Solution
A method where the laser equipment acquires test data and sends it to a processing server for conversion into repair data in a predetermined format, allowing the laser equipment to obtain and utilize the repair data without performing local format conversion, thereby improving equipment utilization and reducing errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser equipment performs local format conversion of test data, then the repair process can be completed, but the limited storage space causes errors and reduces repair efficiency
Solution Approach 1:
The patent extracts the data format conversion function from the laser equipment and relocates it to an external processing server. This removes the storage burden from the laser equipment, allowing it to focus solely on the repair operation without being constrained by limited local storage capacity.
Solution Approach 2:
The patent introduces a processing server as an intermediary between the test data source and the laser equipment. This mediator handles the complex data conversion and preprocessing tasks, transforming raw test data into a format suitable for laser repair without requiring the laser equipment to store or process large volumes of raw data locally.
2Reliability
If laser equipment stores test data locally for conversion, then the repair can proceed, but errors are more prone to occur reducing repair effectiveness
Solution Approach 1:
The patent extracts the data processing and conversion functions from the laser equipment to an external processing server. This separation reduces the complexity within the laser equipment itself, minimizing the sources of potential errors and improving overall system reliability.
Solution Approach 2:
The processing server automatically performs data conversion and preprocessing without requiring complex local processing capabilities in the laser equipment. This self-service approach to data preparation simplifies the laser equipment's functionality and reduces error-prone operations.
Data Source
AI summary
The present disclosure provides a wafer repair method, system, apparatus and device, and a storage medium, relating to the field of semiconductor devices. The method includes: a laser equipment acquires test data for repairing a predetermined wafer; the laser equipment sending the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; and the laser equipment obtaining the repair data in the predetermined format to repair the predetermined wafer.