Laser Scanning Patterns for Wafer Substrate Separation
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Solution Overview
Problem
The existing methods for manufacturing light emitting elements are inefficient in separating thin semiconductor layered bodies from substrates, leading to reduced yield due to time-consuming and precise operations required to avoid damage.
Innovation Solution
A method involving a wafer with a substrate and semiconductor layered body, where the wafer is irradiated with laser light using two scanning patterns: one that enlarges the irradiated region outward or inward from the inner/outer side, and another that intersects with the circumferential edge at multiple portions, facilitating faster and more precise separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional separation methods are used for thin semiconductor layered bodies, then damage to the semiconductor layers is avoided, but the separation process becomes time-consuming and reduces manufacturing yield
Solution Approach 1:
The patent replaces mechanical separation methods with laser-based separation. The laser beam irradiates the interface between the substrate and semiconductor layered body, utilizing optical energy to induce thermal effects that facilitate separation without direct mechanical contact, thereby preventing damage while accelerating the process
Solution Approach 2:
The laser irradiation induces localized phase transitions (melting/vaporization) at the substrate-semiconductor interface. This phase change creates a separation path through the bonding interface, enabling rapid and clean separation without mechanical force that could damage the thin semiconductor layers
2Manufacturing precision
If highly precise operations are performed to separate the semiconductor layered body, then damage is avoided, but the operation time increases significantly
Solution Approach 1:
The patent replaces precision mechanical operations with laser beam control. The laser can be precisely positioned and controlled to irradiate only the required separation areas, eliminating the need for time-consuming manual precision operations while maintaining high separation accuracy
Solution Approach 2:
The laser irradiation performs preliminary action by creating separation paths at critical locations (such as the circumferential edges) before complete separation is needed. This preliminary conditioning of the interface facilitates subsequent separation across the entire wafer surface, reducing total separation time while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the time required for substrate and semiconductor layered body separation, thereby improving the manufacturing yield and handling of semiconductor elements.
Implementation Method 1
irradiating the wafer with laser light by performing first and second patterns of scanning
Implementation Method 2
separating the substrate from the semiconductor layered body
Data Source
AI summary
A method of manufacturing a light emitting element includes: providing a wafer including a substrate and a semiconductor layered body formed at an upper surface of the substrate; irradiating the wafer with laser light by performing first and second patterns of scanning; and separating the substrate from the semiconductor layered body. In the first pattern of scanning, the wafer is irradiated with the laser light outwardly from an inner side of the wafer or inwardly from an outer side of the wafer, so that a region irradiated with the laser light enlarges. In the second pattern of scanning, the wafer is irradiated with the laser light so that the laser light intersects with a circumferential edge of the wafer at a plurality of portions.