Laser Wafer Secondary Machining for Uniform Thickness Control
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Solution Overview
Problem
Existing methods for modifying solid bodies to separate them into portions result in significant variations in thickness due to material inhomogeneities, necessitating complex secondary machining processes.
Innovation Solution
A method generating control data for secondary machining using laser beams, which involves analyzing modifications within the solid body, defining threshold values, and using this data to guide laser treatment for uniform thickness production, incorporating optical characterization and iterative machining strategies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser beams are used to modify solid body and separate it into portions, then separation is achieved, but significant variations in thickness occur due to material inhomogeneities
Solution Approach 1:
The patent applies preliminary action by performing optical characterization and analyzing material inhomogeneities before the separation process. The system identifies regions with varying thickness and material properties in advance, allowing preprocessing or compensation measures to be taken before final separation, thereby reducing thickness variations in the separated portions.
Solution Approach 2:
The patent implements feedback by using optical characterization to detect material inhomogeneities and thickness variations, then using this information to adjust and optimize the separation process. The system continuously monitors and adapts machining parameters based on detected variations, ensuring more uniform thickness in separated portions while maintaining separation efficiency.
2Manufacturing precision
If complex secondary machining is performed to address thickness variations, then manufacturing precision is improved, but device complexity and processing time increase
Solution Approach 1:
The patent uses optical feedback to detect material inhomogeneities and guide the separation process, reducing the need for complex secondary machining. By providing real-time information about thickness variations, the system can adjust parameters to achieve better uniformity in a single pass, simplifying the overall process.
Solution Approach 2:
The patent replaces complex mechanical secondary machining with optical characterization and guided separation. Instead of using multiple mechanical machining steps to correct thickness variations, the system uses optical fields to detect and guide a optimized separation process, reducing device complexity while maintaining precision.
3Manufacturing precision
If optical characterization is performed during or after machining, then material inhomogeneities are identified, but additional processing time is required
Solution Approach 1:
The patent merges optical characterization with the machining process by performing detection during or immediately after modification. The optical characterization is integrated into the workflow rather than being a separate post-processing step, allowing simultaneous or overlapping execution of machining and detection operations, thus reducing total processing time while maintaining detection accuracy.
Solution Approach 2:
The patent performs optical characterization at an optimal point in the process flow, either during modification or immediately afterward, to identify inhomogeneities before final separation. This timing allows the characterization information to be used directly for optimizing the separation process without adding significant time, as the detection and separation are coordinated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures even thickness in separated solid layers by identifying and addressing material inhomogeneities through optical characterization, enabling more efficient and homogeneous crack progression during secondary machining.
Implementation Method 1
The characterization is preferably carried out through the detection and evaluation of the occurring reflection and/or transmission of light
Implementation Method 2
The characterization is preferably carried out through the detection and evaluation of the occurring reflection and/or transmission of light
Implementation Method 3
the modifications were preferably produced by means of the laser beams
Implementation Method 4
the modifications were preferably produced by means of the laser beams
Data Source
AI summary
The present invention relates to a method for generating control data for the secondary machining of a solid body (1), in particular wafer, which is modified by means of laser beams (10). The interior of said solid body (1) has multiple modifications (12), said modifications (12) having been produced by means of laser beams (10). The method comprises the following steps: defining a criterion of analysis for analyzing the modifications (12) produced in the interior of the solid body (1); defining a threshold value with respect to the criterion of analysis, an analytical value on one side of the threshold value triggering a secondary machining registration; analyzing the wafer by means of an analytical unit (4), said analytical unit (4) analyzing the modifications (12) with respect to the criterion of analysis and outputting analytical values regarding the analyzed modifications, said analytical values lying above or below the threshold value; outputting location data with respect to the analyzed modifications, said location data containing information regarding in which region(s) of the solid body (1) the analytical value lie above or below the threshold value; and generating control data for controlling a laser treatment device (11) for the secondary machining of the solid body (1), said control data comprising at least the location data of the modifications (12) registered for secondary machining.