Laser Weeding Multi-Layer Films by Converting Inlets to Cavities
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Solution Overview
Problem
Traditional methods for weeding unwanted material from multi-layered materials, especially in areas like cavities and inlets, are time-consuming and labor-intensive, often resulting in material tearing or breaking, leaving behind small scrap portions that require manual removal.
Innovation Solution
The method involves determining inlet portions of a design, converting them into cavities that can be blown out by adjusting laser cutting parameters, and generating new design contours to simplify the weeding process, allowing for automated removal of scrap without manual intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual weeding methods are used to remove scrap material, then complete removal of unwanted material can be achieved, but the process becomes time-consuming and labor-intensive
Solution Approach 1:
The patent replaces manual mechanical weeding operations with an automated laser-based system. The laser cutting device automatically identifies and removes scrap material from multi-layered materials, substituting human labor and manual tools with an automated optical-mechanical system that operates without direct human intervention.
Solution Approach 2:
The system enables self-service by allowing the laser cutting device to autonomously perform the weeding operation. The automated control system identifies scrap areas and executes removal without requiring continuous manual guidance or intervention, making the process self-sufficient and dramatically reducing labor requirements.
2Productivity
If laser cutting is used to blow through cavities, then weeding time is reduced, but small scrap portions still tear or break at inlet portions requiring manual removal
Solution Approach 1:
The patent applies local quality by differentiating the treatment of different regions within the design contour. The system identifies inlet portions specifically and applies a different cutting strategy (kiss-cutting without blowing through) compared to cavity portions (blow-through cutting). This localized approach prevents tearing at inlets while maintaining efficiency for cavities.
Solution Approach 2:
The patent segments the design contour into distinct regions: cavity portions and inlet portions. By dividing the continuous contour into these functional segments, the system can apply appropriate cutting parameters to each segment type, ensuring complete removal of cavity scrap while preventing inlet tears that would require manual intervention.
3Manufacturing precision
If kiss cutting is used through film and adhesive layers only, then design contours are preserved, but all surrounding scrap must be manually weeded
Solution Approach 1:
The patent introduces dynamics by making the cutting depth adjustable and variable during the weeding process. The laser cutting device can dynamically change between kiss-cutting mode (cutting through film and adhesive only) and blow-through mode (cutting through all layers), allowing the system to adapt to different regions of the design and optimize both precision and ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and labor required for weeding, prevents material tearing, and ensures efficient removal of scrap, even for brittle materials, by converting inlets into cavities that can be easily blown out, thus streamlining the process and reducing costs.
Implementation Method 1
By adjusting the power, travel speed, and wavelength of the laser beam, both kiss cutting and blow through cutting can be performed on a single design
Implementation Method 2
Newer cutting technologies such as laser cutting have improved the process of weeding cavities out from the desired design
Data Source
AI summary
A method of weeding a design in a substrate have a first layer and a second layer is disclosed. The method determines an outline of the design and an inlet portion of the outline. The inlet portion is defined on at least a first and second side by the outline of the design and is open on at least a third side. The method cuts through the first layer but not the second layer along at least a portion of the outline that is not included in the inlet portion. The method also cuts through both the first and second layers along the inlet portion of the outline. The method also cuts through both the first and second layers along a path that closes the third side of the inlet portion.