Laser-Welded Connector Housing for Compact Waterproof Sealing
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Solution Overview
Problem
Existing connector apparatuses are large in size and complex to manufacture due to their multiple parts, which complicates achieving excellent waterproof performance.
Innovation Solution
A connector apparatus comprising a circuit board with a conductor path, a resin-made cylindrical housing with a terminal projecting outward, and a mold resin portion that collectively covers the circuit board, terminal, and housing, featuring a welded portion around the entire periphery of the housing with minimal width variation, formed by laser welding through the mold resin portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a housing with multiple parts (case and cover) and sealant is used to achieve waterproof performance, then waterproof performance is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent merges the housing and mold resin portion into a single integrated structure where the mold resin portion collectively covers the circuit board, terminal, and housing. This eliminates the need for separate case and cover parts with sealant, reducing the number of parts while maintaining waterproof performance through the welded portion that provides continuous protection.
Solution Approach 2:
The patent uses composite materials by welding together the resin housing and mold resin portion to form an integrated waterproof structure. This composite approach replaces the traditional mechanical assembly with sealant with a fused joint that provides both structural integrity and waterproofing in a single unit.
2Reliability
If a housing with multiple parts and sealant is used to achieve waterproof performance, then waterproof performance is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent combines the housing and mold resin portion into a single welded structure, eliminating the need for separate assembly steps involving sealant application and curing. This reduces manufacturing complexity by replacing multi-step assembly with a single welding process that simultaneously provides structural support and waterproofing.
Solution Approach 2:
The patent replaces the mechanical assembly system (bolts, clips, sealant application) with a welding process that fuses the housing and mold resin portion together. This substitution simplifies manufacturing by eliminating complex assembly operations while maintaining or improving waterproof performance through the fused joint.
3Ease of manufacture
If the welded portion has large width variation to accommodate manufacturing tolerances, then ease of manufacture is improved, but waterproof performance deteriorates
Solution Approach 1:
The patent specifies that the welded portion has a difference between maximum and minimum width of 30% or less of the maximum width, establishing a quantitative parameter control that balances manufacturing tolerance accommodation with waterproof performance. This parameter constraint ensures sufficient sealing effectiveness while allowing for practical manufacturing variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a compact, easily manufactured connector apparatus with excellent waterproof performance, as the welded portion provides strong adhesion between the housing and the mold resin portion, effectively preventing liquid ingress.
Implementation Method 1
irradiating the integrated article with a laser, wherein the circuit board, the terminal located outside the housing, and a portion of the housing are collectively covered by the mold resin portion, and in the irradiating with the laser, an entire periphery of the housing is irradiated with a laser all at once through the mold resin portion, and constituent materials of the housing and the mold resin portion are welded together
Implementation Method 2
an entire periphery of the housing is irradiated with a laser all at once through the mold resin portion
Data Source
AI summary
Provided is a connector apparatus including: a circuit board; a connector; and a mold resin portion, wherein the circuit board includes a conductor path, the connector includes a housing with a cylindrical shape and made of a resin, and a terminal projecting outward in an axial direction of the housing from inside the housing, the terminal being configured to connect to the conductor path, the mold resin portion collectively covers the circuit board, the terminal located outside the housing, and a portion of the housing; the housing and the mold resin portion include a welded portion formed by welding together constituent materials of the housing and the mold resin portion, and the welded portion is provided around an entire periphery of the housing and has a difference between a maximum width and a minimum width along a circumferential direction of the housing of 30% or less of the maximum width.