Laser Welding Fixed Portion for Flexible Light-Emitting Device Separation
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Solution Overview
Problem
The challenge is to prevent separation at the interface between the light-emitting layer and the electrode in light-emitting devices with flexible substrates, which can lead to damage when external physical forces like bending or curving are applied, especially in touch panel applications.
Innovation Solution
A method involving the formation of a spacer made of a light-absorbing material over a partition on one substrate and a coloring layer on the other, where laser light is used to melt the bonding layer and create a fixed portion that securely bonds the substrates without separating at the interface between the light-emitting layer and the electrode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If physical force separation is used to separate the layer to be separated from the base material, then separation can be achieved, but separation may occur at the interface between the light-emitting layer and the electrode
Solution Approach 1:
The patent applies preliminary action by forming a fixed portion that bonds the first substrate and second substrate together before the separation process. This pre-bonding prevents separation at the light-emitting layer/electrode interface during the subsequent separation step, as the structural integrity is already established through the fixed portion created by laser irradiation.
Solution Approach 2:
The patent introduces an intermediary approach by using a fixed portion as a mediator between the first substrate and second substrate. This fixed portion, formed by laser irradiation of the spacer and bonding layer, acts as a stabilizing element that prevents harmful separation at critical interfaces while allowing the separation process to proceed.
2Adaptability or versatility
If the light-emitting device uses a flexible substrate, then flexibility and impact resistance are improved, but the device may be damaged when external physical forces are applied
Solution Approach 1:
The patent applies preliminary action by creating a fixed portion that reinforces the structural integrity of the flexible substrate assembly before external forces are applied. This pre-established bonding region ensures that when flexibility is utilized or external forces are applied, the device maintains its structural integrity and prevents damage at critical interfaces.
Solution Approach 2:
The patent implements beforehand cushioning by forming a fixed portion that acts as a protective reinforcement against future external physical forces. This pre-created structural support cushions the flexible substrate assembly against potential damage from bending, curving, or other mechanical stresses that may be applied during use.
3Productivity
If laser ablation is used to separate the separation layer, then separation efficiency is improved, but the bonding layer may not be sufficiently bonded
Solution Approach 1:
The patent applies preliminary action by performing laser irradiation to form a fixed portion that bonds the substrates together before the separation process. This ensures that the bonding layer is sufficiently bonded and the structural integrity is maintained before separation occurs, preventing damage while enabling efficient separation.
Solution Approach 2:
The patent replaces the mechanical separation approach with a controlled laser irradiation process. Instead of using physical force that might damage the bonding, laser energy is used to selectively form a fixed portion and then enable separation, substituting mechanical action with optical energy for more precise and damage-free separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures that the light-emitting device remains intact under external physical forces, maintaining its structural integrity and functionality, particularly in flexible substrate applications like touch panels.
Implementation Method 1
a spacer made of a light-absorbing material over a partition on one substrate
Implementation Method 2
laser light is used to melt the bonding layer
Implementation Method 3
laser light is used to melt the bonding layer and create a fixed portion
Data Source
AI summary
An object is to provide a method for manufacturing a light-emitting device including a flexible substrate, in which separation is performed without separation at the interface between the light-emitting layer and the electrode. A spacer formed of a light absorbing material which absorbs laser light is formed over a partition of one of substrates, a coloring layer is formed over the other substrate, and the substrates are bonded to each other with the use of a bonding layer. The light-emitting layer and the electrode which are formed over the spacer are irradiated with laser light through the coloring layer, so that at least the bonding layer among the light-emitting layer, the electrode, the coloring layer, and the bonding layer is melted to form a fixed portion where the bonding layer and the spacer are bonded by welding.