Laser Welded Glass Packaging for OLED Moisture Resistance
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Solution Overview
Problem
Current glass packaging technologies for OLED displays, such as UV solidification and frit packaging, are inadequate due to sensitivity to moisture and oxygen, and frit glue height control issues, leading to packaging failures and increased costs.
Innovation Solution
A glass packaging method involving forming glass packaging lines with a specific pattern on a substrate using physical or chemical etching, followed by laser welding to ensure consistent height and prevent damage to active areas, while maintaining a controlled environment to prevent moisture and oxygen ingress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If UV solidification packaging technology is used, then packaging efficiency and environmental friendliness are improved, but moisture and oxygen penetration increases
Solution Approach 1:
The patent changes the material parameter from UV glue to frit glass powder, fundamentally altering the packaging material's properties to achieve both moisture resistance and efficient coupling. This material substitution resolves the contradiction by providing a substance that inherently blocks moisture and oxygen while still enabling effective glass substrate bonding.
Solution Approach 2:
The patent uses frit glass powder as a composite material that combines the benefits of glass (moisture and oxygen barrier) with packaging functionality. The frit material creates a hermetic seal that prevents harmful factor penetration while maintaining packaging efficiency through laser welding capability.
2Object-affected harmful factors
If frit packaging technology is used, then moisture and oxygen resistance is improved, but glass powder height control becomes difficult
Solution Approach 1:
The patent replaces the traditional mechanical coating and baking process with a laser welding system. The laser precisely melts and fuses the frit glass powder, providing accurate height control and consistent coupling without relying on difficult-to-control thermal processing parameters.
Solution Approach 2:
The patent utilizes the phase transition of frit glass powder from solid to molten state during laser welding, then back to solid upon cooling. This controlled phase transition enables precise height adjustment and consistent coupling, overcoming the height control difficulties of traditional baking methods.
3Manufacturing precision
If laser welding is used to couple glass substrates, then coupling precision is improved, but risk of damaging active area increases
Solution Approach 1:
The patent applies local quality by concentrating the laser energy only on the frit glass powder at the bonding interface, not on the entire glass substrate or active area. This localized heating achieves precise coupling while preventing heat damage to sensitive components through spatially selective energy delivery.
Solution Approach 2:
The frit glass powder acts as an intermediary material between the two glass substrates. The laser welds through this intermediate layer, which absorbs and confines the thermal energy at the bonding interface, protecting the active area from direct heat exposure while still achieving precise coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the defect-free rate and reduces operational costs by ensuring precise glass substrate coupling and minimizing the impact of moisture and oxygen sensitivity, thereby improving OLED display longevity.
Implementation Method 1
irradiating the glass packaging lines by a laser to weld the two glass substrates together
Implementation Method 2
forming glass packaging lines with a specific pattern upon a packaging glass substrate by a physical or chemical etching method
Data Source
AI summary
The present invention provides a glass packaging structure, comprising an active glass substrate and a packaging glass substrate. An active area is formed upon the active glass substrate. Glass packaging lines are formed on a surface of the packaging glass substrate and the glass packaging lines protruding from the packaging glass substrate. The packaging glass substrate entirely overlapping upon the active glass substrate and then the glass packaging lines are irradiated by a laser to couple the packaging glass substrate and the active glass substrate.