Laser-Welded Pin Header Attachment Without PCB Through-Holes
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Solution Overview
Problem
Existing methods for attaching pin-shaped contact elements to conductive paths on conductor plates, such as soldering and through-hole technology, are complex and require the use of flux or drilling, which can be simplified by a surface-mounted laser welding process.
Innovation Solution
The contact element is welded to the conductive path using a laser beam guided along a spiral path, with one end flattened to facilitate better heat distribution and localized heating, eliminating the need for flux and drilling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to attach contact element to conductive path, then reliable electrical connection is achieved, but flux must be used and removed which increases process complexity
Solution Approach 1:
The patent replaces the chemical soldering process with a mechanical/thermal laser welding process. The laser beam directly melts and fuses the contact element to the conductive path without requiring flux, eliminating the complex flux application and removal steps while maintaining reliable electrical connection.
Solution Approach 2:
The patent extracts and eliminates the flux component from the attachment process. By using laser welding instead of soldering, the harmful and complex flux material is completely removed from the process, simplifying the overall manufacturing procedure.
2Reliability
If through-hole technology is used to attach contact element, then secure mechanical and electrical connection is achieved, but drilling of holes is required which increases process complexity
Solution Approach 1:
The patent extracts and eliminates the hole drilling step from the attachment process. By using surface-mounted laser welding, the contact element is directly welded to the surface of the conductor plate without requiring any holes to be drilled, significantly simplifying the manufacturing process.
Solution Approach 2:
Instead of passing the contact element through holes from one side to the other, the patent inverts the approach by welding the contact element directly to the surface. This reverse methodology eliminates the need for through-holes while achieving secure attachment.
3Device complexity
If laser beam is used for welding contact element to conductive path, then process complexity is reduced, but heat distribution during welding needs improvement
Solution Approach 1:
The patent uses a spiral scanning path for the laser beam instead of a linear or point-by-point approach. This curved/spiral trajectory allows the laser energy to be distributed more evenly across the contact element and conductive path interface, improving heat distribution and welding quality.
Solution Approach 2:
The patent applies preliminary action by flattening one end of the contact element before welding. This pre-processing step creates a larger surface area and more uniform thermal contact, facilitating better heat distribution during the subsequent laser welding process.
4Temperature
If contact element end is flattened before welding, then heat distribution is improved, but additional processing step is required
Solution Approach 1:
The patent merges the flattening operation with the existing contact element manufacturing process. By integrating this preliminary shaping step into the standard production flow, the additional processing is minimized and becomes part of the normal manufacturing sequence rather than a separate complex operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the attachment process, reduces thermal stress, and allows for surface-mounted components without holes, enabling efficient and stress-reduced welding in Surface Mount Technology (SMT).
Implementation Method 1
the contact element is welded to the conductive path in a surface-mounted manner by means of a laser beam
Implementation Method 2
the contact element is welded to the conductive path in a surface-mounted manner by means of a laser beam
Implementation Method 3
one end, which is to be welded, of the contact element is flattened before welding. This enable particularly good heating during a welding process
Data Source
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AI summary
Shown is a method of attaching at least one, in particular pin-shaped, contact element (10) to a conductive path (21) of a conductor plate (20), characterised in that the contact element (10) is welded to the conductive path (21) in a surface-mounted manner by means of a laser beam (30). Further disclosed is a pin header (100) for attaching to a conductor plate (20), comprising at least one, in particular pin-shaped, contact element (10), wherein the at least one contact element (10) is welded onto a surface (22) of a conductive path (21) of the conductor plate (20) as a surface-mounted component. A connection assembly (200) comprises a pin header (100) according to the invention and a conductor plate (20), wherein a contact element (10) of the pin header (100) is welded onto the conductive path (21) of the conductor plate (20) as a surface-mounted component.