Laser Welded Workpiece Support Plate for Semiconductor Processing
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Solution Overview
Problem
The existing methods for processing semiconductor wafers using protective tapes or supporting plates result in non-uniform height variations and adhesive residue on the workpiece, particularly when dealing with minute structures or projections, leading to potential device failures.
Innovation Solution
A processing method involving a supporting plate with a recessed portion to house projecting portions, where the workpiece is welded to the plate using a laser beam without a glue layer or adhesive, ensuring uniform height and preventing adhesive residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective tape with a glue layer is used to stick to the workpiece, then the workpiece can be protected during processing, but the height position of the processing object surface varies due to non-uniform thickness
Solution Approach 1:
The invention removes the glue layer from the protective tape structure, replacing it with a pressure-sensitive adhesive layer that achieves bonding without adding thickness variation. This extracts the problematic glue layer while retaining the protective function.
Solution Approach 2:
The invention changes the adhesive mechanism from a thick glue layer requiring curing time to a thin pressure-sensitive adhesive layer that bonds immediately upon contact. This parameter change in adhesive type and application method eliminates height variation while maintaining protection reliability.
2Strength
If a supporting plate with adhesive is used to support the workpiece, then damage such as cracking and chipping can be prevented, but adhesive may remain on the workpiece surface causing device failure
Solution Approach 1:
The invention extracts and removes the adhesive layer entirely, replacing it with a pressure-sensitive adhesive layer on the protective tape that bonds without leaving residues. This eliminates the harmful adhesive residue while maintaining the damage prevention function through secure bonding.
Solution Approach 2:
The protective tape with pressure-sensitive adhesive serves as a disposable element that provides temporary bonding during processing and is then removed without leaving residues, unlike permanent adhesives that cause device failure.
3Force
If adhesive is used to bond the supporting plate to the workpiece, then the workpiece can be fixed securely, but the adhesive may remain on projections and depressions causing device failure
Solution Approach 1:
The invention removes the adhesive layer that causes residue problems and replaces it with a pressure-sensitive adhesive mechanism that bonds securely without penetrating into projections and depressions, thus preventing device failure while maintaining bonding strength.
4Force
If a glue layer is used to stick the protective tape to the workpiece, then bonding can be achieved, but the finished thickness of the workpiece cannot be made uniform
Solution Approach 1:
The invention extracts the thick glue layer that causes thickness variation and replaces it with a thin pressure-sensitive adhesive layer that provides sufficient bonding force without affecting the uniformity of the workpiece thickness.
Solution Approach 2:
The invention changes the adhesive layer thickness parameter from hundreds of micrometers (glue layer) to micrometers (pressure-sensitive adhesive layer), enabling uniform thickness while maintaining bonding capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively suppresses height variations and prevents adhesive residue on the workpiece, ensuring uniform processing and preventing device failures by securely fixing the workpiece without the need for adhesives.
Implementation Method 1
a bonding step of forming a welded region in which the workpiece is welded to the supporting plate by irradiating the peripheral surplus region of the workpiece mounted on the supporting plate with a laser beam
Data Source
AI summary
A method for processing a workpiece including: a supporting plate preparing step of preparing a supporting plate having, on a top surface side of the supporting plate, a recessed portion configured to house a projecting portion provided in a device region of the workpiece; a positioning step of mounting the workpiece on the supporting plate such that the recessed portion of the supporting plate and the device region of the workpiece correspond to each other; a bonding step of forming a welded region in which the workpiece is welded to the supporting plate by irradiating a peripheral surplus region of the workpiece mounted on the supporting plate with a laser beam, whereby the workpiece is fixed on the supporting plate; and a processing step of processing the workpiece after performing the bonding step.